Hinged laminated body, layout sheet for hinged laminated body, and manufacturing method for hinged laminated body

ABSTRACT

A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body, equipped with: an IC module having an IC chip capable of performing contactless communication; a hinge layer having a hinge section which can be bound into a booklet; a non-hinge layer which is laminated onto the hinge layer and does not have a hinge part, wherein the hinge layer is disposed over the entire surface of the laminated body having the hinge, the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and the IC module is housed and held inside the housing hole.

TECHNICAL FIELD

The present invention relates to a hinged laminated body bound into abooklet, a layout sheet for the hinged laminated body, and a method ofmanufacturing the hinged laminated body.

BACKGROUND ART

Conventionally, there has been an inlet which has an electroniccomponent and is bound into a booklet such as a passport (for example,Patent Document 1).

However, in the conventional inlet, a hinge has been attached bylaminating a hinge layer onto a card-like medium having an electroniccomponent. For this reason, the conventional inlet has a large overallthickness.

In addition, conventionally, there has been a data page bound into abooklet such as a passport (for example, Patent Document 2).

However, the data page has a hinge section which is a portion bound intothe booklet, and thus manufacture is difficult when compared to an ICcard, etc.

-   Patent Document 1: European Patent Publication, No. 2287012,    Specification-   Patent Document 2: Japanese Unexamined Patent Application,    Publication No. 2012-38324

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

An object of the invention is to provide a thin hinged laminated bodyand a layout sheet for the hinged laminated body.

Another object of the invention is to provide a layout sheet for ahinged laminated body which is easy to manufacture and a method ofmanufacturing the hinged laminated body.

Means for Solving the Problems

The invention solves problems using solution means below. Even though adescription will be given by assigning reference numerals correspondingto embodiments of the invention to facilitate understanding, theinvention is not limited thereto. In addition, a configuration describedby assigning a reference numeral thereto may be modified as appropriate,and at least a part thereof may be replaced with another component.

A 1-1st invention is a hinged laminated body including an IC module (30)having an IC chip capable of performing contactless communication, ahinge layer (41, 241, 541, 641) having a hinge section (41 a) bindableinto a booklet, and a non-hinge layer (42, 242, 542, 642) which islaminated on the hinge layer and does not have a hinge section, whereinthe hinge layer is provided on an entire surface of the hinged laminatedbody, the hinge layer and the non-hinge layer have a housing hole (47,247, 547, 647) penetrating across the two layers, and the IC module ishoused and held in the housing hole.

A 1-2nd invention is the hinged laminated body according to the 1-1stinvention, wherein the IC module further has a mounted substrate (31) onone surface of which the IC chip (32) is mounted, a width of the mountedsubstrate is larger than a width of the IC chip in a cross-sectionalview, and the housing hole is divided into a first housing hole (47 a)on a side of the hinge layer and a second housing hole (47 b) on a sideof the non-hinge layer in the cross-sectional view, the first housinghole houses one of the mounted substrate and the IC chip, and the secondhousing hole houses the other one of the mounted substrate and the ICchip.

A 1-3rd invention is the hinged laminated body according to the 1-2ndinvention, wherein the first housing hole or the second housing holehousing the IC chip has an amount of a width not allowing the mountedsubstrate to be housed.

A 1-4th invention is the hinged laminated body according to any one ofthe 1-1st invention to the 1-3rd invention, wherein a meltingtemperature of the hinge layer is different from a melting temperatureof the non-hinge layer.

A 1-5th invention is the hinged laminated body according to any one ofthe 1-1st invention to the 1-4th invention, further including an antenna(35) connected to the IC chip, wherein one of or both the hinge layerand the non-hinge layer have an antenna buried groove (48, 248, 548,648) in which the antenna is buried.

A 1-6th invention is the hinged laminated body according to any one ofthe 1-1st invention to the 1-5th invention, further including an upperlayer (50) laminated on an upper side of the hinge layer and thenon-hinge layer, and a lower layer (60) laminated on a lower side of thehinge layer and the non-hinge layer.

A 1-7th invention is the hinged laminated body according to the 1-6thinvention, wherein the hinge layer and the non-hinge layer havetranslucency, the upper layer includes an upper layer window portion(56) through which a part of one of the hinge layer and the non-hingelayer close to the upper layer is visually recognizable, and the lowerlayer includes a lower layer window portion (66) through which a part ofone of the hinge layer and the non-hinge layer close to the lower layeris visually recognizable and which is provided in a region overlappingthe upper layer window portion.

A 1-8th invention is a layout sheet for a hinged laminated body in whicha plurality of hinged laminated bodies according to any one of the 1-1stinvention to the 1-7th invention is arranged.

A 1-9th invention is a booklet in which the hinged laminated bodyaccording to any one of the 1-1st invention to the 1-7th invention isbound at the hinge section included in the hinged laminated body.

A 2-1st invention is a hinged laminated body including an IC module(1030) having an IC chip capable of performing contactlesscommunication, an antenna (1035) connected to the IC chip, and a hingelayer (1041, 1241, 1341, 1441, 1541) having a hinge section (1041 a)bindable into a booklet, wherein the hinge layer is laminated on a partof the hinged laminated body when an upper surface of the hingedlaminated body is viewed in a normal direction, and the hinged laminatedbody further includes a thickness adjustment layer (1042, 1242, 1342,1442, 1542) which is laminated at a same position as a position of thehinge layer in a thickness direction, has a thickness corresponding tothe hinge layer, and holds at least one of the IC module and theantenna.

A 2-2nd invention is the hinged laminated body according to the 2-1stinvention, wherein the thickness adjustment layer (1042, 1242, 1542)forms at least a part of a housing hole (1047) that holds the IC module(1030) by housing the IC module therein.

A 2-3rd invention is the hinged laminated body according to the 2-1stinvention, further including a housing hole (1347, 1447) that houses theIC module (1030), wherein the thickness adjustment layer (1342, 1442)covers an opening of the housing hole.

A 2-4th invention is the hinged laminated body according to the 2-1stinvention or the 2-3rd invention, further including an antenna buriedlayer (1043) having an antenna buried groove (1048) in which the antenna(1035) is buried, wherein the thickness adjustment layer (1042) holdsthe antenna by covering an opening of the antenna buried groove of theantenna buried layer.

A 2-5th invention is the hinged laminated body according to the 2-1stinvention or the 2-2nd invention, wherein the thickness adjustment layer(1242, 1542) includes an antenna buried groove (1048, 1248) that holdsthe antenna (1035) buried therein.

A 2-6th invention is the hinged laminated body according to any one ofthe 2-1st invention to the 2-5th invention, further including an upperlayer (1050) laminated on an upper side of the hinged laminated body(1020, 1220, 1320, 1420, 1520), and a lower layer (1060) laminated on alower side of the hinged laminated body.

A 2-7th invention is the hinged laminated body according to the 2-6thinvention, wherein the hinge layer (1041, 1241, 1341, 1441, 1541) and/orthe thickness adjustment layer (1042, 1242, 1342, 1442, 1542) hastranslucency, the upper layer (1050) includes an upper layer windowportion (1056) through which a part of the hinge layer and the thicknessadjustment layer is visually recognizable, and the lower layer (1060)includes a lower layer window portion (1066) through which a part of thehinge layer and the thickness adjustment layer is visually recognizableand which is provided in a region overlapping the upper layer windowportion.

A 2-8th invention is a layout sheet for a hinged laminated body in whicha plurality of hinged laminated bodies (1020, 1220, 1320, 1420, 1520)according to any one of the 2-1st invention to the 2-7th invention isarranged.

A 2-9th invention is a booklet in which the hinged laminated body (1020,1220, 1320, 1420, 1520) according to any one of the 2-1st invention tothe 2-5th invention is bound at the hinge section (1041 a) included inthe hinged laminated body.

A 3-1st invention is a layout sheet for a hinged laminated body (2020A,2220A) in which a plurality of hinged laminated bodies (2020, 2220) isarranged, wherein the hinged laminated body includes an IC chip (2032)capable of performing contactless communication, an antenna (2035)connected to the IC chip, and a hinge layer (2041) having a hingesection (2041 a, 2241 a) bindable into a booklet.

A 3-2nd invention is the layout sheet for a hinged laminated bodyaccording to the 3-1st invention, wherein the hinge section (2041 a,2241 a) protrudes at a side surface on a bound side.

A 3-3rd invention is the layout sheet for a hinged laminated bodyaccording to the 3-1st invention or the 3-2nd invention, wherein hingesections (2041 a, 2241 a) of adjacent hinged laminated bodies (2020-1and 2020-2, 2020-3 and 2020-4, 2220) are disposed along at least oneside of the layout sheet for a hinged laminated body (2020A, 2220A).

A 3-4th invention is the layout sheet for a hinged laminated bodyaccording to any one of the 3-1st invention to the 3-3rd invention,wherein hinge sections (2041 a, 2241 a) of adjacent hinged laminatedbodies (2020-1 and 2020-3, 2020-2 and 2020-4, 2220) are disposed onopposite sides of the layout sheet for a hinged laminated body (2020A,2220A).

A 3-5th invention is the layout sheet for a hinged laminated bodyaccording to any one of the 3-1st invention to the 3-4th invention,wherein a hinge layer sheet material (2241A) in which hinge layers ofthe plurality of hinged laminated bodies (2220) are arranged islaminated exclusively at an edge of a side along a side surface fromwhich the hinge section (2241 a) protrudes.

A 3-6th invention is the layout sheet for a hinged laminated bodyaccording to any one of the 3-1st invention to the 3-4th invention,wherein a hinge layer sheet material (2041A) in which hinge layers(2041) of the plurality of hinged laminated bodies (2020) are arrangedis larger than an external shape of another sheet material (2042A,2045A, 2046A) of the layout sheet for a hinged laminated body (2020A)and is laminated on an entire surface of the layout sheet for a hingedlaminated body.

A 3-7th invention is the layout sheet for a hinged laminated bodyaccording to the 3-1st invention or the 3-2nd invention, wherein hingesections (2241 a) of adjacent hinged laminated bodies (2220) aredisposed along at least one side of the layout sheet for a hingedlaminated body (2220A), and a hinge layer sheet material (2241A) inwhich hinge layers of the adjacent hinged laminated bodies are arrangedis laminated exclusively at an edge along at least the one side.

A 3-8th invention is a layout sheet for a hinged laminated body (2320A,2420A) in which a plurality of hinged laminated bodies (2320, 2420) isarranged, wherein the hinged laminated body includes an IC chip (2032)capable of performing contactless communication, an antenna (2035)connected to the IC chip, and a hinge layer (2341A, 2441A) having ahinge section (2341 a, 2441 a) bindable into a booklet, and hingesections of adjacent hinged laminated bodies are disposed on an insideof the layout sheet for a hinged laminated body, and the adjacent hingedlaminated bodies are connected through the hinge sections thereof.

A 3-9th invention is the layout sheet for a hinged laminated bodyaccording to the 3-8th invention, wherein the hinge section (2341 a,2441 a) protrudes at a side surface on a bound side.

A 3-10th invention is the layout sheet for a hinged laminated bodyaccording to the 3-8th invention or the 3-9th invention, wherein thehinge layer (2441A) of the hinged laminated body (2420) is laminatedexclusively at an edge of a side along a side surface from which thehinge section (2441 a) protrudes.

A 3-11th invention is the layout sheet for a hinged laminated bodyaccording to the 3-8th invention or the 3-9th invention, wherein a hingelayer sheet material (2341A) in which hinge layers of the plurality ofhinged laminated bodies (2320) are arranged is larger than an externalshape of another sheet material (2342A, 2345A, 2346A) of the layoutsheet for a hinged laminated body (2320A) and is laminated on an entiresurface of the layout sheet for a hinged laminated body.

A 3-12th invention is a method of manufacturing a hinged laminated body(2020, 2220, 2320, 2420) using the layout sheet for the hinged laminatedbody according to any one of the 3-1st invention to the 3-11thinvention, the method including an individual piece separation processof separating the hinged laminated bodies into individual pieces suchthat the hinge sections (2041 a, 2241 a, 2341 a, 2441 a) remain bycutting the layout sheet for the hinged laminated body (2020A, 2220A,2320A, 2420A).

A 3-13th invention is a method of manufacturing a hinged laminated body(2010, 2210, 2310, 2410) using the layout sheet for the hinged laminatedbody (2020A, 2220A, 2320A, 2420A) according to any one of the 3-1stinvention to the 3-11th invention, the method including an upper layerlamination process of laminating an upper layer layout sheet (2051A,2052A, 2055A, 2351A, 2352A, 2355A) in which a plurality of upper layersis arranged on the layout sheet for the hinged laminated body, a lowerlayer lamination process of laminating a lower layer layout sheet inwhich a plurality of lower layers (2061A, 2065A, 2361A, 2365A) isarranged on the layout sheet for the hinged laminated body, a hotpressing process of thermally welding layers of the layout sheet for thehinged laminated body at interfaces thereof, and the upper layer layoutsheet and the lower layer layout sheet, and an individual pieceseparation process of separating the hinged laminated bodies intoindividual pieces such that the hinge sections (2041 a, 2241 a, 2341 a,2441 a) remain by cutting the thermally welded layers.

Effects of the Invention

According to the invention, it is possible to provide a thin hingedlaminated body and a layout sheet for the hinged laminated body.

In addition, according to the invention, it is possible to provide alayout sheet for a hinged laminated body which is easy to manufactureand a method of manufacturing the hinged laminated body.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a diagram for description of a configuration of a single partof a hinged laminated body 10 of a 1-1st embodiment;

FIG. 1B is a diagram for description of the configuration of the singlepart of the hinged laminated body 10 of the 1-1st embodiment;

FIG. 2A is a diagram for description of a passport 1 of the 1-1stembodiment;

FIG. 2B is a diagram for description of the passport 1 of the 1-1stembodiment;

FIG. 3A is a diagram for description of a layout sheet for the hingedlaminated body 10A of the 1-1st embodiment;

FIG. 3B is a diagram for description of the layout sheet for the hingedlaminated body 10A of the 1-1st embodiment;

FIG. 4A is a diagram for description of a configuration of a layoutsheet for the hinged laminated body 20A of the 1-1st embodiment;

FIG. 4B is a diagram for description of the configuration of the layoutsheet for the hinged laminated body 20A of the 1-1st embodiment;

FIG. 5A is a cross-sectional view for description of a method ofmanufacturing the layout sheet for the hinged laminated body 20A of the1-1st embodiment;

FIG. 5B is a cross-sectional view for description of the method ofmanufacturing the layout sheet for the hinged laminated body 20A of the1-1st embodiment;

FIG. 5C is a cross-sectional view for description of the method ofmanufacturing the layout sheet for the hinged laminated body 20A of the1-1st embodiment;

FIG. 5D is a cross-sectional view for description of the method ofmanufacturing the layout sheet for the hinged laminated body 20A of the1-1st embodiment;

FIG. 6 is a cross-sectional view of a hinged laminated body 210 of a1-2nd embodiment;

FIG. 7 is a cross-sectional view of a hinged laminated body 310 of a1-3rd embodiment;

FIG. 8 is a cross-sectional view of a hinged laminated body 410 of a1-4th embodiment;

FIG. 9 is a cross-sectional view of a hinged laminated body 510 of a1-5th embodiment;

FIG. 10 is a cross-sectional view of a hinged laminated body 610 of a1-6th embodiment;

FIG. 11A is a diagram for description of a configuration of a singlepart of a hinged laminated body 1010 of a 2-1st embodiment;

FIG. 11B is a diagram for description of the configuration of the singlepart of the hinged laminated body 1010 of the 2-1st embodiment;

FIG. 12A is a diagram for description of a passport 1001 of the 2-1stembodiment;

FIG. 12B is a diagram for description of the passport 1001 of the 2-1stembodiment;

FIG. 13A is a diagram for description of a configuration of a layoutsheet for the hinged laminated body 1010A of the 2-1st embodiment;

FIG. 13B is a diagram for description of the configuration of the layoutsheet for the hinged laminated body 1010A of the 2-1st embodiment;

FIG. 14A is a diagram for description of a configuration of a layoutsheet for the hinged laminated body 1020A of the 2-1st embodiment;

FIG. 14B is a diagram for description of the configuration of the layoutsheet for the hinged laminated body 1020A of the 2-1st embodiment;

FIG. 15A is a cross-sectional view for description of a method ofmanufacturing the layout sheet for the hinged laminated body 1020A ofthe 2-1st embodiment;

FIG. 15B is a cross-sectional view for description of the method ofmanufacturing the layout sheet for the hinged laminated body 1020A ofthe 2-1st embodiment;

FIG. 15C is a cross-sectional view for description of the method ofmanufacturing the layout sheet for the hinged laminated body 1020A ofthe 2-1st embodiment;

FIG. 15D is a cross-sectional view for description of the method ofmanufacturing the layout sheet for the hinged laminated body 1020A ofthe 2-1st embodiment;

FIG. 15E is a cross-sectional view for description of the method ofmanufacturing the layout sheet for the hinged laminated body 1020A ofthe 2-1st embodiment;

FIG. 15F is a cross-sectional view for description of the method ofmanufacturing the layout sheet for the hinged laminated body 1020A ofthe 2-1st embodiment;

FIG. 16 is a cross-sectional view of a hinged laminated body 1210 of a2-2nd embodiment;

FIG. 17 is a cross-sectional view of a hinged laminated body 1310 of a2-3rd embodiment;

FIG. 18 is a cross-sectional view of a hinged laminated body 1410 of a2-4th embodiment;

FIG. 19 is a cross-sectional view of a hinged laminated body 1510 of a2-5th embodiment;

FIG. 20A is a diagram for description of a layout sheet for a hingedlaminated body 2010A of a 3-1st embodiment:

FIG. 20B is a diagram for description of the layout sheet for the hingedlaminated body 2010A of the 3-1st embodiment;

FIG. 21A is a diagram for description of a configuration of a singlepart of a hinged laminated body 2020 of the 3-1st embodiment;

FIG. 21B is a diagram for description of the configuration of the singlepart of the hinged laminated body 2020 of the 3-1st embodiment;

FIG. 22A is a diagram for description of a configuration of a layoutsheet for a hinged laminated body 2020A of the 3-1st embodiment;

FIG. 22B is a diagram for description of the configuration of the layoutsheet for the hinged laminated body 2020A of the 3-1st embodiment;

FIG. 23A is a diagram for description of a configuration of a singlepart of a hinged laminated body 2010 of the 3-1st embodiment;

FIG. 23B is a diagram for description of the configuration of the singlepart of the hinged laminated body 2010 of the 3-1st embodiment;

FIG. 24A is a diagram for description of a passport 2001 of the 3-1stembodiment;

FIG. 24B is a diagram for description of the passport 2001 of the 3-1stembodiment;

FIG. 25A is a cross-sectional view for description of the layout sheetfor the hinged laminated body 2020A and a method of manufacturing thelayout sheet for the hinged laminated body 2010A of the 3-1stembodiment;

FIG. 25B is a cross-sectional view for description of the layout sheetfor the hinged laminated body 2020A and the method of manufacturing thelayout sheet for the hinged laminated body 2010A of the 3-1stembodiment;

FIG. 25C is a cross-sectional view for description of the layout sheetfor the hinged laminated body 2020A and the method of manufacturing thelayout sheet for the hinged laminated body 2010A of the 3-1stembodiment;

FIG. 25D is a cross-sectional view for description of the layout sheetfor the hinged laminated body 2020A and the method of manufacturing thelayout sheet for the hinged laminated body 2010A of the 3-1stembodiment;

FIG. 25E is a cross-sectional view for description of the layout sheetfor the hinged laminated body 2020A and the method of manufacturing thelayout sheet for the hinged laminated body 2010A of the 3-1stembodiment;

FIG. 26A is a diagram for description of a layout sheet for a hingedlaminated body 2220A of a 3-2nd embodiment;

FIG. 26B is a diagram for description of the layout sheet for the hingedlaminated body 2220A of the 3-2nd embodiment;

FIG. 26C is a diagram for description of the layout sheet for the hingedlaminated body 2220A of the 3-2nd embodiment:

FIG. 27A is a diagram for description of a layout sheet for a hingedlaminated body 2310A of a 3-3rd embodiment;

FIG. 27B is a diagram for description of the layout sheet for the hingedlaminated body 2310A of the 3-3rd embodiment;

FIG. 28A is a diagram for description of a layout sheet for a hingedlaminated body 2320A of the 3-3rd embodiment;

FIG. 28B is a diagram for description of the layout sheet for the hingedlaminated body 2320A of the 3-3rd embodiment;

FIG. 28C is a diagram for description of the layout sheet for the hingedlaminated body 2320A of the 3-3rd embodiment;

FIG. 29A is a diagram for description of a layout sheet for a hingedlaminated body 2420A of a 3-4th embodiment;

FIG. 29B is a diagram for description of the layout sheet for the hingedlaminated body 2420A of the 3-4th embodiment; and

FIG. 29C is a diagram for description of the layout sheet for the hingedlaminated body 2420A of the 3-4th embodiment.

PREFERRED MODE FOR CARRYING OUT THE INVENTION Embodiments

Hereinafter, embodiments of the invention will be described withreference to drawings, etc.

1-1st Embodiment [Configuration of Hinged Laminated Body 10 (SinglePart)]

FIG. 1A and FIG. 1B are diagrams for description of a configuration of asingle part of a hinged laminated body 10 of a 1-1st embodiment.

FIG. 1A is a diagram of the hinged laminated body 10 viewed from anupper side Z2 in a thickness direction Z (a normal direction of an uppersurface).

FIG. 1B is a cross-sectional view (B-B sectional view of FIG. 1A) of thehinged laminated body 10.

FIG. 1B is a cross-sectional view passing through an IC module 30 andillustrates a mode of color development of a laser color developmentlayer 52 and window portions 56 and 66. The above description is appliedto the following drawings.

FIG. 2A and FIG. 2B are diagrams for description of a passport 1 of the1-1st embodiment.

FIG. 2A is a perspective view of a state in which a page formed by thehinged laminated body 10 is open.

FIG. 2B is a cross-sectional view (B-B sectional view of FIG. 2A) of thestate in which the page formed by the hinged laminated body 10 is open.

In embodiments and drawings, an XYZ orthogonal coordinate system isprovided to facilitate understanding of description. This coordinatesystem represents a left-right direction X (left side X1, right sideX2), a longitudinal direction Y (lower side Y1, upper side Y2), and thethickness direction Z (lower side Z1, upper side Z2) with reference tothe state of FIG. 1A.

The hinged laminated body 10 is bound into the passport 1 of a booklet.That is, the hinged laminated body 10 is used for an identification datapage of the passport 1 (also referred to as an IC passport, etc.)incorporating an IC chip 32.

Use of the hinged laminated body 10 is not limited to the passport 1,and the hinged laminated body 10 may be used for, for example,management of a book, etc. by being bound into the book.

The hinged laminated body 10 includes a hinged laminated body 20, anupper layer 50, a lower layer 60, and a hologram layer 70. The hingedlaminated body 20 constitutes a part of the hinged laminated body 10including the upper layer 50, the lower layer 60, the hologram layer 70,etc. When there is a need to distinguish between the hinged laminatedbody 10 having the upper layer 50 and the lower layer 60 and the hingedlaminated body 20 not having the upper layer 50 and the lower layer 60,the hinged laminated body 10 and the hinged laminated body 20 areappropriately referred to as an (upper layer/lower layer-equipped)hinged laminated body (10) and a (non-upper layer/lower layer-equipped)hinged laminated body (20), respectively.

As illustrated in FIG. 2A and FIG. 2B, a hinge section 41 a of thehinged laminated body 20 is bound together with other pages 6 and acover 7 using a thread 5, etc. In this way, the hinged laminated body 10is bound into the passport 1.

Details of the hinged laminated body 20 are described below.

As illustrated in FIG. 1A and FIG. 1B, the upper layer 50 is laminatedon the upper side Z2 of the hinged laminated body 20, and the lowerlayer 60 is laminated on the lower side Z1 of the hinged laminated body20.

The hinge section 41 a of the hinged laminated body 20 protrudes to theright side X2 from right side surfaces of these layers.

The upper layer 50 includes a base material layer 51, the laser colordevelopment layer 52, a transparent protective layer 55, and an upperlayer window portion 56. There layers are laminated in this order fromthe lower side Z1 to the upper side Z2. The base material layer 51, thelaser color development layer 52, and the transparent protective layer55 are formed of a colorless and transparent sheet material havingtranslucency.

The base material layer 51 serves as a base layer of the hingedlaminated body 10.

The base material layer 51 includes print layers 51 a and 51 c.

The print layer 51 a is printed on an upper surface of the base materiallayer 51 by offset printing, etc. Print content of the print layer 51 ais a picture, etc., and is, for example, a character, a pattern, asymbol, etc. according to a specification of the passport 1. In theexample of FIG. 1A and FIG. 1B, the print content of the print layer 51a is character information 51 b of “PASSPORT”, “country: AAAA”, and“NAME:”. The print content is common to all users. That is, this printcontent does not include individual information of a user (for example,a photograph, a name, etc. of the user).

The print layer 51 c is solidly formed on a lower surface of the basematerial layer 51 by silk printing, etc. It may be preferable to adoptink which does not transmit light and has a high light concealingproperty (for example, white and highly concealing ink, etc.) as ink forthe print layer 51 c.

The print layers 51 a and 51 c are not provided in a region of the upperlayer window portion 56. That is, the print layers 51 a and 51 c areomitted in the region of the upper layer window portion 56.

The laser color development layer 52 contains a color developer. Forthis reason, a range of the laser color development layer 52 to whichlaser light is applied generates heat and develops a black color. In theembodiment, such color development is also referred to as typing orprinting.

Print content of the laser color development layer 52 is individualinformation of the user. In the example of FIG. 1A and FIG. 1B, only aphotograph image 52 b and information “BBB CCC” of a name 52 c of theuser are illustrated. However, in practice, information such as a dateof birth, a passport number, etc. is printed.

The material of the laser color development layer 52 may not contain thecolor developer as long as color is developed by irradiation with laserlight. In addition, color development may include a color other thanblack.

FIG. 1A and FIG. 1B illustrate a state in which the hinged laminatedbody 10 develops color to describe the print content of the laser colordevelopment layer 52. However, printing of the laser color developmentlayer 52 may be performed after the hinged laminated body 10 is boundinto the passport 1.

The transparent protective layer 55 is a protective layer for protectingthe laser color development layer 52.

The upper layer window portion 56 is a rectangular portion in which theprint layers 51 a and 51 c are not provided. For this reason, whenviewed in the thickness direction Z, a region in the upper layer windowportion 56 is observed to be transparent.

The lower layer 60 includes a base material layer 61, a transparentprotective layer 65, and a lower layer window portion 66. These layersare laminated in this order from the upper side Z2 to the lower side Z1.

The base material layer 61 and the transparent protective layer 65 aresimilar layers to the base material layer 51 and the transparentprotective layer 55 of the upper layer 50. That is, a configuration ofthe base material layer 61 is as follows.

The base material layer 61 is a layer serving as a base material of thehinged laminated body 10 and includes print layers 61 a and 61 c. Theprint layer 61 a is provided on the lower side Z1 of the base materiallayer 61, and a picture, etc. corresponding to print content thereof isnot illustrated and is common to all users.

The print layer 61 c is provided on the upper side Z2 of the basematerial layer 61 to conceal light. The print layers 61 a and 61 c areomitted in a region of the lower layer window portion 66.

The transparent protective layer 65 is a protective layer for protectingthe base material layer 61 and the print layer 61 a thereof.

The lower layer window portion 66 corresponds to a rectangular region inwhich the print layer 61 a and the print layer 61 c are not provided,and is observed to be transparent when viewed in the thickness directionZ.

When viewed in the thickness direction Z, an external shape of the upperlayer window portion 56 is equal to and aligned with an external shapeof the lower layer window portion 66. The invention is not limited tothe above described, and the external shape of one of the upper layerwindow portion 56 and the lower layer window portion 66 may be one sizelarger than the external shape of the other one.

The hologram layer 70 is laminated between the hinged laminated body 20and the upper layer 50. When viewed from the upper side Z2, an externalshape of the hologram layer 70 is one size larger than the windowportions 56 and 66.

The hologram layer 70 is transparent. For example, a hologram image 71such as a Lippmann hologram, an emboss type hologram, etc. may berecorded in the hologram layer 70. The hologram image 71 is disposedinside the window portions 56 and 66. The hologram image 71 may betranslucent.

In the example of FIG. 1B, the hologram layer 70 is disposed on thelower side Z1 of the upper layer window portion 56, and thus overlapsthe upper layer window portion 56 in an XY plane when viewed from theupper side Z2. However, the invention is not limited thereto. It may bepossible to adopt a mode in which the hologram layer 70 is disposed at aposition not overlapping the upper layer window portion 56.

In addition, in the example of FIG. 1B, the hologram layer 70 isdisposed on the lower side Z1 of the laser color development layer 52and the upper side Z2 of the hinged laminated body 20. However, theinvention is not limited thereto. It may be possible to adopt a mode inwhich the hologram layer 70 is disposed on the upper side Z2 of thelaser color development layer 52.

According to this arrangement, when laser irradiation is performed totamper with printing information of the laser color development layer52, the hologram layer 70 on the upper side Z2 is destroyed. For thisreason, it may be possible to increase the effect of preventingfalsification.

According to the above configuration, the print content of the lasercolor development layer 52 in the upper layer 50 is observable throughthe transparent protective layer 55. The print content of the printlayer 51 a on the base material layer 51 is observable through the lasercolor development layer 52 and the transparent protective layer 55. Inaddition, the print content of the print layer 61 a on the base materiallayer 61 in the lower layer 60 is observable through the transparentprotective layer 65.

In addition, since layers other than the print layers 51 a, 51 c, 61 a,and 61 c have translucency, an upper surface of the hinged laminatedbody 20 is visually recognizable in the upper layer window portion 56,when viewed from the upper side Z2. Further, in a part of the windowportions 56 and 66 in which the hologram image 71 of the hologram layer70 is not present, the lower side Z1 of the hinged laminated body 20(opposite side from an observation side) is observed, that is, the partis observed to be colorless and transparent (see an arrow L1). Inaddition, in a part of the window portions 56 and 66 in which thehologram image 71 of the hologram layer 70 is present, the hologramimage 71 is observable (see an arrow L2).

When observed from the lower side Z1, the lower surface of the hingedlaminated body 20 is visually recognizable in the lower layer windowportion 66. For this reason, an observation mode in the lower layerwindow portion 66 is the same as an observation mode in the upper layerwindow portion 56.

Meanwhile, since the print layers 51 c and 61 c on the base materiallayers 51 and 61 have high light concealing property, respectively, thehinged laminated body 20 may not be visually recognized. For thisreason, the hinged laminated body 10 may blind a part such as an antenna35, and an appearance is excellent, accordingly.

[Configuration of Hinged Laminated Body 20 (Single Part)]

The hinged laminated body 20 is laminated substantially at a center ofthe hinged laminated body 10 in the thickness direction Z.

The hinged laminated body 20 includes an IC module 30, the antenna 35, ahinge layer 41, an intermediate layer 42 (antenna buried layer) as anon-hinge layer, an upper protective layer 45, a lower protective layer46, an IC module housing hole 47, and an antenna buried groove 48.

The lower protective layer 46, the intermediate layer 42, the hingelayer 41, and the upper protective layer 45 are laminated in this orderfrom the lower side Z1 to the upper side Z2. These layers are joined bythermal welding. For this reason, a sheet material of a resin (forexample, PET-G, PVC, PC, etc.) having excellent compatibility withterminal welding is used as these materials. The intermediate layer 42has a single layer structure or a multi-layer structure of a resin sheetmaterial. The upper protective layer 45 and the lower protective layer46 each have the similar structure.

External shapes of the intermediate layer 42, the lower protective layer46, and the upper protective layer 45 are equal to one another. Anexternal shape of the hinge layer 41 is larger than the external shapesof the intermediate layer 42, the lower protective layer 46, and theupper protective layer 45. This dimensionally exceeding part of thehinge layer 41 constitutes the hinge section 41 a.

A melting temperature of the hinge layer 41 may be different from amelting temperature of the intermediate layer 42. For example, when adifference between melting temperatures is larger than 50 degrees ormore, a resin having a lower melting temperature is more likely to flowinto the IC module housing hole 47 (described below) at the time ofthermal welding, and a gap between the housing hole 47 and the IC module30 may be reduced.

For example, a relationship between the hinge layer 41 and theintermediate layer 42, and the upper layer 50 and the lower layer 60 isas follows.

The upper layer 50 is a layer laminated above the hinge layer 41 and theintermediate layer 42. The lower layer 60 is a layer laminated below thehinge layer 41 and the intermediate layer 42.

A part of one of the hinge layer 41 and the intermediate layer 42 whichis closer to the upper layer 50 may be visually recognized through theupper layer window portion 56. A part of one of the hinge layer 41 andthe intermediate layer 42 which is closer to the lower layer 60 may bevisually recognized through the lower layer window portion 66.

The IC module 30 includes a mounted substrate 31 and an IC chip 32.

The mounted substrate 31 is a substrate for mounting the IC chip 32. Alead frame (not illustrated) of the IC chip 32 is connected to themounted substrate 31.

The IC chip 32 is a semiconductor integrated circuit element andincludes a central processing unit (CPU) serving as a controller and astorage device (for example, an EEPROM). Identification information,etc. is stored in the storage device.

The IC chip 32 may be of a type performing contactless communicationwith an external device such as a reader/writer.

The IC chip 32 is mounted on a lower surface (one surface) of themounted substrate 31 and is sealed (packaged) with resin, etc.

The antenna 35 may be a winding of a covered conductive wire in a coilshape (spiral shape). The covered conductive wire is configured suchthat a periphery of the conductive wire is covered with an electricalinsulator.

Both ends of the antenna 35 and the lead frame of the IC chip 32 areconnected with an electrically conductive paste, etc. In this way, theantenna 35 and the IC chip 32 are electrically connected to each other.

Connection between the IC chip 32 and the antenna 35 is not limited tothe above-mentioned mode. For example, the lead frame of the IC chip 32and the both ends of the antenna 35 may be directly connected to eachother.

Communication between the IC module 30 as well as the antenna 35 and anexternal device is performed through short-range wireless communicationbased on an electromagnetic induction scheme (for example, acommunication scheme according to ISO/IEC14443, ISO/IEC15693,ISO/IEC18092, etc.).

The hinge layer 41 is larger than external shapes of other layers 42,45, and 46 of the hinged laminated body 20. For this reason, the hingelayer 41 is provided to be laminated on the entire surface of the hingedlaminated body 20. “The hinge layer 41 is provided on the entire surfaceof the hinged laminated body 20.” means that the external shape of thehinge layer 41 coincides with the external shape of the hinged laminatedbody 20. For example, the IC module housing hole 47 and other windowportions and openings may be present in the hinge layer 41.

The hinge layer 41 includes a hinge section 41 a.

The hinge section 41 a is a portion bound into the passport 1 (see FIG.2B).

The hinge section 41 a protrudes from a side surface, which is boundinto the passport 1 (a right side surface in FIG. 1A and FIG. 1B), amongside surfaces of the hinged laminated body 20. In addition, the hingelayer 41 forms a part of the IC module housing hole 47.

The hinge layer 41 has (i) sufficient flexibility for functioning as ahinge, (ii) sufficient tensile strength for preventing breaking, etc.,(iii) sufficient durability for preventing breaking even after repeatedbending, etc. For example, the hinge layer 41 may be configured suchthat a fiber such as PET, polyamide, etc. is disposed in a lattice shapebetween layers of a plurality of PET-G resin sheets, etc.

The intermediate layer 42 is a layer for adjusting a thickness of the ICchip 32.

The upper protective layer 45 is a sheet material that protects the ICmodule 30, the hinge layer 41, etc. by being laminated on the upper sideZ2 of the hinge layer 41.

Similarly, the lower protective layer 46 is a sheet material thatprotects the IC module 30, the intermediate layer 42, etc. by beinglaminated on the lower side Z1 of the intermediate layer 42.

The IC module housing hole 47 is a hole for housing the IC module 30.The IC module housing hole 47 is a through-hole penetrating the hingelayer 41 and the intermediate layer 42. The hinge layer 41 and theintermediate layer 42 hold the IC module 30 by housing the IC module 30in the IC module housing hole 47. The IC module housing hole 47 mayinclude a bottomed hole.

In a cross-sectional view, a width of the mounted substrate 31 is largerthan a width of the IC chip 32. In the cross-sectional view, the housinghole 47 is divided into a first housing hole 47 a on the hinge layer 41side and a second housing hole 47 b on the intermediate layer 42 side.The first housing hole 47 a houses one of the mounted substrate 31 andthe IC chip 32. The second housing hole 47 b houses the other one of themounted substrate 31 and the IC chip 32. In the example of FIG. 1A andFIG. 1B, the mounted substrate 31 is housed in the first housing hole 47a. The IC chip 32 is housed in the second housing hole 47 b. It may bepreferable that one of the mounted substrate 31 and the IC chip 32having a thickness close to a thickness of the hinge layer 41 is housedin the first housing hole 47 a on the hinge layer 41 side.

The first housing hole 47 a or the second housing hole 47 b, either ofwhich houses the IC chip 32, has an amount of a width not allowing themounted substrate 31 to be housed. In the example of FIG. 1A and FIG.1B, a width of the second housing hole 47 b is smaller than a width ofthe mounted substrate 31, and the mounted substrate 31 may not be housedin the second housing hole 47 b.

The antenna buried groove 48 is a groove provided on an upper surface ofthe intermediate layer 42. As described below, the antenna buried groove48 is formed by burying the antenna 35 using hot pressing in a state inwhich the antenna 35 is disposed. For this reason, when viewed from theupper side Z2, the antenna buried groove 48 is located the same as theantenna 35. The hinge layer 41 is laminated immediately above theintermediate layer 42. For this reason, the intermediate layer 42 housesthe antenna 35 in the antenna buried groove 48, and the hinge layer 41covers an opening of the antenna buried groove 48. In this way, thehinge layer 41 and the intermediate layer 42 may hold the antenna 35.

[Layout Sheet for Hinged Laminated Body 10A]

FIG. 3A and FIG. 3B are diagrams for description of a layout sheet for ahinged laminated body 10A of the 1-1st embodiment.

FIG. 3A is a diagram of the layout sheet for the hinged laminated body10A viewed from the upper side Z2 in the thickness direction Z (normaldirection of the upper surface).

FIG. 3B is a cross-sectional view of the layout sheet for the hingedlaminated body 10A (B-B sectional view of FIG. 3A).

In the figures, a cut portion 2 of a cutting process by pressing (thatis, the external shape of the hinged laminated body 10) is indicated bya two-dot chain line.

The layout sheet for the hinged laminated body 10A is a sheet materialin which a plurality of hinged laminated bodies 10 is arranged.

When viewed from the upper side Z2, a total of four hinged laminatedbodies 10 are arranged, two in the longitudinal direction Y and two inthe left-right direction X. The number of the hinged laminated bodies 10in the longitudinal direction Y may be appropriately set according toconvenience in manufacturing. In addition, FIG. 3A and FIG. 3Billustrates an example in which a space 3 (blank) is provided betweenthe hinged laminated bodies 10. However, the space 3 may be deleted asappropriate.

Left and right hinge sections 41 a protrude from left and right sidesurfaces of a layout sheet for the hinged laminated body 20A in thestate of the layout sheet for the hinged laminated body 10A.

A laminated configuration of the layout sheet for the hinged laminatedbody 10A corresponds to a laminated configuration of the hingedlaminated body 10.

That is, in the layout sheet for the hinged laminated body 10A, atransparent protective layer sheet material 65A, a base material layersheet material 61A, the layout sheet for the hinged laminated body 20A,the hologram layer 70, a base material layer sheet material 51A, a lasercolor development layer sheet material 52A, and a transparent protectivelayer sheet material 55A are laminated in this order from the lower sideZ1 to the upper side Z2.

The base material layer sheet material 51A, the laser color developmentlayer sheet material 52A, and the transparent protective layer sheetmaterial 55A correspond to a sheet material (upper layer layout sheet)in which four members forming the upper layer 50 are arranged in an XYplane direction.

That is, the base material layer sheet material 51A is a sheet materialin which four base material layers 51 are arranged in the XY planedirection. In addition, the laser color development layer sheet material52A and the transparent protective layer sheet material 55A are sheetmaterials in which four laser color development layers 52 and fourtransparent protective layers 55 are arranged in the XY plane direction,respectively. Arrangement of four members of each of the sheet materialscorresponds to arrangement of four hinged laminated bodies 20 of thelayout sheet for the hinged laminated body 20A (see FIG. 4A and FIG.4B).

Similarly, the base material layer sheet material 61A and thetransparent protective layer sheet material 65A correspond to a sheetmaterial (lower layer layout sheet) in which four members forming thelower layer 60 are arranged in the XY plane direction at positionscorresponding to the hinged laminated bodies 20 of the layout sheet forthe hinged laminated body 20A.

[Layout Sheet for Hinged Laminated Body 20A]

FIG. 4A and FIG. 4B are diagrams for description of a configuration ofthe layout sheet for the hinged laminated body 20A of the 1-1stembodiment.

FIG. 4A is a diagram of the layout sheet for the hinged laminated body20A viewed from the upper side Z2 in the thickness direction Z (normaldirection of the upper surface).

FIG. 4B is a cross-sectional view of the layout sheet for the hingedlaminated body 20A (B-B sectional view of FIG. 4A).

The layout sheet for the hinged laminated body 20A is a sheet materialin which a plurality of hinged laminated bodies 20 is arranged.

Arrangement of the hinged laminated bodies 20 of the layout sheet forthe hinged laminated body 20A is similar to the layout sheet for thehinged laminated body 10A.

That is, when viewed from the upper side Z2, a total of four hingedlaminated bodies 20 are arranged, two in the longitudinal direction Yand two in the left-right direction X. In a hinged laminated body 20 onthe left side X1, a hinge section 41 a is disposed on the left side X1.Meanwhile, in a hinged laminated body 20 on the right side X2, a hingesection 41 a is disposed on the right side X2. Two hinged laminatedbodies 20 on the left side X1 and two hinged laminated bodies 20 on theright side X2 are disposed point-symmetrically with respect to thelayout sheet for the hinged laminated body 20A. The number of hingedlaminated bodies 20 in the longitudinal direction Y and the space 3 maybe modified similarly to the layout sheet for the hinged laminated body10A.

When there is a need to distinguish between the layout sheet for thehinged laminated body 10A having the upper layer 50 and the lower layer60 and the layout sheet for the hinged laminated body 20A not having theupper layer 50 and the lower layer 60, the layout sheet for the hingedlaminated body 10A and the layout sheet for the hinged laminated body20A are appropriately referred to as an (upper layer/lowerlayer-equipped) layout sheet for the hinged laminated body (10A) and a(non-upper layer/lower layer-equipped) layout sheet for the hingedlaminated body (20A), respectively.

A laminated configuration of the layout sheet for the hinged laminatedbody 20A corresponds to a laminated configuration of the hingedlaminated body 20.

That is, in the layout sheet for the hinged laminated body 20A, a lowerprotective layer sheet material 46A, an intermediate layer sheetmaterial 42A, a hinge layer sheet material 41A, and an upper protectivelayer sheet material 45A are laminated in this order from the lower sideZ1 to the upper side Z2.

The hinge layer sheet material 41A is a sheet material in which fourhinge layers 41 are arranged in the XY plane direction. Similarly, theintermediate layer sheet material 42A, the upper protective layer sheetmaterial 45A, and the lower protective layer sheet material 46A aresheet materials in which members of four intermediate layers 42, fourupper protective layers 45, and four lower protective layers 46 arearranged, respectively. Arrangement of the four members of each of thesheet materials corresponds to arrangement of four hinged laminatedbodies 20 of the layout sheet for the hinged laminated body 20A.

Left and right hinge sections 41 a protrude from left and right sidesurfaces of the layout sheet for the hinged laminated body 20A in thestate of the layout sheet for the hinged laminated body 20A.

[Manufacturing Method]

FIG. 5A and FIG. 5D are cross-sectional views for description of amethod of manufacturing the layout sheet for the hinged laminated body20A of the 1-1st embodiment.

(Method of Manufacturing Layout Sheet for Hinged Laminated Body 20A)

When the layout sheet for the hinged laminated body 20A is manufactured,the hinge layer sheet material 41A, the intermediate layer sheetmaterial 42A, the upper protective layer sheet material 45A, and thelower protective layer sheet material 46A are manufactured in advance ina previous process thereof. A hole is provided by punching in each ofthe hinge layer sheet material 41A (see FIG. 5A) and the intermediatelayer sheet material 42A (see FIG. 5C). The hole forms the IC modulehousing hole 47.

The layout sheet for the hinged laminated body 20A may be manufacturedaccording to the following processes.

(1) Formation Process of Antenna 35

As illustrated in FIG. 5A, the antenna 35 is buried in the intermediatelayer sheet material 42A by hot pressing in a state in which the antenna35 is disposed in a coil shape on an upper surface of the intermediatelayer sheet material 42A. Four antennas 35 may be buried at the sametime. Alternatively, the antenna 35 may be buried in the hinge layersheet material 41A.

In this case, hot pressing may also be performed in a state in which thefour antennas 35 are disposed in the hinge layer sheet material 41A.

(2) Connection Process of IC Module 30 and Antenna 35

As illustrated in FIG. 5B, the IC module 30 is housed in the IC modulehousing hole 47 of the intermediate layer sheet material 42A. Inaddition, the mounted substrate 31 and the both ends of the antenna 35are connected electrically and mechanically with each other by anelectrically conductive paste, etc.

(3) Lamination Process

As illustrated in FIG. 5C, the hinge layer sheet material 41A, theintermediate layer sheet material 42A, the upper protective layer sheetmaterial 45A, and the lower protective layer sheet material 46A arelaminated.

Here, when the hinge layer sheet material 41A and the intermediate layersheet material 42A are laminated, centers of IC module housing holes 47of the two sheet materials are positioned to align with each other. Inthis way, four hinge sections 41 a of the hinge layer sheet material 41Aprotrude the same length from both ends of the intermediate layer sheetmaterial 42A.

In this way, the lamination process of the hinge layer sheet material41A has excellent workability.

(4) Hot Pressing Process

As illustrated in FIG. 5C and FIG. 5D, hot pressing is performed in astate in which the respective sheet materials are laminated. In thisway, the respective layers are thermally welded at interfaces thereof.

Accordingly, it is possible to manufacture the layout sheet for thehinged laminated body 20A.

(Method of Manufacturing Layout Sheet for Hinged Laminated Body 10A andHinged Laminated Body 10)

When the layout sheet for the hinged laminated body 10A is manufactured,the layout sheet for the hinged laminated body 20A, the base materiallayer sheet materials 51A and 61A, the laser color development layersheet material 52A, the transparent protective layer sheet materials 55Aand 65A, and the hologram layer 70 are manufactured in advance in aprevious process thereof.

The layout sheet for the hinged laminated body 10A may be manufacturedaccording to the following processes.

(1) Lamination Process of Upper Layer 50 (Upper Layer LaminationProcess)

The hologram layer 70, the base material layer sheet material 51A, thelaser color development layer sheet material 52A, and the transparentprotective layer sheet material 55A are laminated on the upper side Z2of the layout sheet for the hinged laminated body 20A (see FIG. 3B).

(2) Lamination Process of Lower Layer 60 (Lower Layer LaminationProcess)

The base material layer sheet material 61A and the transparentprotective layer sheet material 65A are laminated on the lower side Z1of the layout sheet for the hinged laminated body 20A (see FIG. 3B).

(3) Hot Pressing Process

Hot pressing is performed in a state in which the respective members arelaminated in the above processes (1) and (2). In this way, therespective layers are thermally welded at interfaces thereof.

Through the processes so far, it is possible to manufacture the layoutsheet for the hinged laminated body 10A in which the hinged laminatedbodies 10 are arranged.

(4) Individual Piece Separation Process

Separation into individual pieces is performed by cutting throughpressing the layout sheet for the hinged laminated body 10A thermallywelded in the above process (3) into external shapes of the respectivehinged laminated bodies 10. In this way, the four hinged laminatedbodies 10 may be manufactured.

In this case, a shape of the cut portion 2 of each hinged laminated body10 is a U-shape in which the hinge section 41 a side is open (see FIG.3A). In this way, the hinge section 41 a remains in each hingedlaminated body 10.

In this way, it is possible to manufacture the hinged laminated body 10in which the hinge section 41 a protrudes from a part of a side surfaceby cutting the layout sheet for the hinged laminated body 10A (that is,the layout sheet for the hinged laminated body 20A) such that four hingesections 41 a remain. For this reason, it is possible to simultaneouslymanufacture a plurality of hinged laminated bodies 10 similarly withconventional card manufacture. In this way, the hinged laminated body 10may be manufactured easily and at low cost.

The hinged laminated body 10 after individual piece separation isprocessed into the passport 1 by binding the hinge section 41 a (seeFIG. 2A and FIG. 2B). In addition, after (or before) being processedinto the passport 1, the hinged laminated body 10 after individual pieceseparation is irradiated with laser light, so that individualinformation of the user is printed (the photograph image 52 b, the name52 c, etc.) (see FIG. 1A).

Binding may be performed in a mode in which a plurality of passports isarranged (so-called multiple layout), in a state in which the layoutsheet for the hinged laminated body 10A is not cut or in a state inwhich the layout sheet for the hinged laminated body 10A is cut in aform of a layout sheet for a hinged laminated body in which a pluralityof (for example, two) hinged laminated bodies 10 is connected to eachother. In this case, the layout sheet for the hinged laminated body 10Ais separated into individual pieces corresponding to the hingedlaminated bodies 10 by separating the passport into individual piecesafter binding.

In this case, separation into individual pieces corresponding to thehinged laminated bodies 10 may be performed after binding, and thus abinding process may be performed according to a specification of abinding machine, convenience in manufacturing, etc.

As described above, the hinge layer 41 of the present embodiment notonly functions as the hinge section 41 a, but also forms a layer forholding electrical components such as the IC module 30, the antenna 35,etc. In addition, the hinged laminated body 20 of the present embodimentincludes the intermediate layer 42 which is laminated on the hinge layer41 and serves as a non-hinge layer not having a hinge section. The hingelayer 41 is provided on the entire surface of the hinged laminated body20. The hinge layer 41 and the intermediate layer 42 have the housinghole 47 penetrating both layers. The IC module 30 is housed and held inthe housing hole 47. For this reason, the thickness of the hingedlaminated body 20 is smaller when compared to a mode in which a layerfor holding the electrical component is separately provided. In thisway, it is possible to reduce the thicknesses of the hinged laminatedbody 20 and the hinged laminated body 10. Since the IC module 30 ishoused in the housing hole 47, it is possible to inhibit a portion inwhich the IC module 30 is provided from bulging in the thicknessdirection. Nonetheless, the hinge section 41 a may be made thin, andflexibility of the hinge section 41 a may be reduced.

1-2nd Embodiment

Next, a description will be given of a 1-2nd embodiment of theinvention.

In the following description and drawings, a portion having the samefunction as that of the above-described 1-1st embodiment will beappropriately denoted by the same reference numeral or the same suffix(last two digits), and a repeated description will be appropriatelyomitted. In addition, in the following description and drawings, aconfiguration of a hinged laminated body will be mainly described, and aconfiguration of a layout sheet for the hinged laminated body in which aplurality of hinged laminated bodies is arranged will not be described.The hinged laminated body may be manufactured by separating the layoutsheet for the hinged laminated body having a laminated configurationcorresponding to laminated configurations of these hinged laminatedbodies into individual pieces.

FIG. 6 is a cross-sectional view of a hinged laminated body 210 of the1-2nd embodiment.

As illustrated in FIG. 6, an antenna 35 of a hinged laminated body 220of the present embodiment is buried in a hinge layer 241.

The hinge layer 241 includes an antenna buried groove 248 in which theantenna 35 is buried.

The antenna buried groove 248 is provided on a lower surface of thehinge layer 241. An intermediate layer 42 is provided immediately belowthe hinge layer 241.

For this reason, the hinge layer 241 houses the antenna 35 in theantenna buried groove 248, and the intermediate layer 42 covers anopening of the antenna buried groove 248. In this way, the hinge layer241 and the intermediate layer 42 hold the antenna 35.

The antenna buried groove 248 of the hinge layer 241 may be formedsimilarly to a method of forming an antenna housing groove on theintermediate layer in the 1-1st embodiment (see FIG. 5A to FIG. 5D).That is, hot pressing may be performed in a state in which the antenna35 is disposed on a lower surface of a hinge layer sheet material.

As described above, in the hinge layer 241 of the present embodiment,similarly to the 1-1st embodiment, a layer for holding an electricalcomponent such as the antenna 35 is formed, and thus thicknesses of thehinged laminated body 220 and the hinged laminated body 210 may bereduced.

1-3rd Embodiment

Next, a description will be given of a 1-3rd embodiment of theinvention. The 1-3rd embodiment is a reference form of the invention.

FIG. 7 is a cross-sectional view of a hinged laminated body 310 of the1-3rd embodiment.

As illustrated in FIG. 7, in a hinged laminated body 320 of the presentembodiment, a lower protective layer 46, an intermediate layer 42, anintermediate layer 349, and a hinge layer 341 are laminated in thisorder from a lower side Z1 to an upper side Z2.

For this reason, the hinge layer 341 is laminated instead of an upperprotective layer as an uppermost layer of the hinged laminated body 320.

The intermediate layer 349 may be formed of the same resin sheetmaterial as that of the intermediate layer 42. Similarly to the hingelayer of the 1-1st embodiment, the intermediate layer 349 holds theantenna 35 by covering an antenna buried groove 48 of the intermediatelayer 42. In addition, the intermediate layer 349 and the intermediatelayer 42 form an IC module housing hole 347 for housing an IC module 30.

The hinge layer 341 is laminated immediately above the intermediatelayer 349, and thus covers an opening of the IC module housing hole 347.In this way, the hinge layer 341, the intermediate layer 42, and theintermediate layer 349 may hold the IC module 30.

As described above, the hinge layer 341 of the present embodiment formsa layer for holding the IC module 30, and thus the hinged laminated body320 does not require an upper protective layer. In this way, it ispossible to reduce thicknesses of the hinged laminated body 320 and thehinged laminated body 310.

1-4th Embodiment

Next, a description will be given of a 1-4th embodiment of theinvention. The 1-4th embodiment is a reference form of the invention.

FIG. 8 is a cross-sectional view of a hinged laminated body 410 of the1-4th embodiment.

As illustrated in FIG. 8, in a hinged laminated body 420 of the presentembodiment, a hinge layer 441, an intermediate layer 42, an intermediatelayer 449, and an upper protective layer 45 are laminated in this orderfrom a lower side Z1 to an upper side Z2.

For this reason, the hinge layer 441 is laminated instead of a lowerprotective layer as a lowermost layer of the hinged laminated body 420.That is, while the hinge layer of the 1-3rd embodiment is laminated asthe uppermost layer of the hinged laminated body, the hinge layer 441 ofthe present embodiment is laminated as the lowermost layer of the hingedlaminated body 420.

Similarly to the 1-3rd embodiment, the intermediate layer 449 and theintermediate layer 42 form an IC module housing hole 447 for housing anIC module 30.

The hinge layer 441 is laminated immediately below the intermediatelayer 42, and thus covers an opening on the lower side Z1 of the ICmodule housing hole 447. In this way, the hinge layer 441, theintermediate layer 42, and the intermediate layer 449 may hold the ICmodule 30.

As described above, the hinged laminated body 420 of the presentembodiment does not require the lower protective layer, and thus it ispossible to reduce thicknesses of the hinged laminated body 410 and thehinged laminated body 420 similarly to the 1-3rd embodiment.

1-5th Embodiment

Next, a description will be given of a 1-5th embodiment of theinvention.

FIG. 9 is a cross-sectional view of a hinged laminated body 510 of the1-5th embodiment.

As illustrated in FIG. 9, in a hinged laminated body 520 of the presentembodiment, a lower protective layer 46, a hinge layer 541, anintermediate layer 542, and an upper protective layer 45 are laminatedin this order from a lower side Z1 to an upper side Z2. For this reason,an IC module hole 547 penetrates the intermediate layer 542 and thehinge layer 541 in this order from the upper side Z2.

In addition, an antenna buried hole 548 is provided on an upper surfaceof the hinge layer 541. Similarly to the 1-2nd embodiment, the antennaburied hole 548 may be hot-pressed in a state in which the antenna 35 isdisposed on an upper surface of a hinge layer sheet material.

In this way, a laminated configuration of the hinged laminated body 520may be modified according to a specification, etc.

1-6th Embodiment

Next, a description will be given of a 1-6th embodiment of theinvention.

FIG. 10 is a cross-sectional view of a hinged laminated body 610 of the1-6th embodiment.

As illustrated in FIG. 10, in a hinged laminated body 620 of the presentembodiment, a lower protective layer 46, a hinge layer 641, anintermediate layer 642, and an upper protective layer 45 are laminatedin this order from a lower side Z1 to an upper side Z2. For this reason,an IC module hole 647 penetrates the intermediate layer 642 and thehinge layer 641 in this order from the upper side Z2.

In addition, an antenna buried hole 648 is provided across both an uppersurface of the hinge layer 641 and a lower surface of the intermediatelayer 642. When hot-press is performed in a state in which the antenna35 is disposed on an upper surface of a hinge layer sheet material or alower surface of an intermediate layer sheet material, the sheetmaterial on the opposite side is recessed by the antenna 35, therebyforming the antenna buried hole 648.

In this way, a laminated configuration of the hinged laminated body 620may be modified according to a specification, etc.

The embodiments of the invention have been described above. However, theinvention is not limited to the above-described embodiments. Forexample, various modifications and changes can be made as inmodifications, etc. described below, which are within a technical scopeof the invention. In addition, effects described in the embodimentsmerely list most suitable effects produced by the invention, and effectsof the invention are not limited to those described in the embodiments.The above-described embodiments and the modifications described belowmay be appropriately combined and used. However, a detailed descriptionthereof will be omitted.

Modifications

(1) In the embodiments, an example in which the (upper layer/lowerlayer-equipped) layout sheet for the hinged laminated body is cut toseparate the (upper layer/lower layer-equipped) hinged laminated bodiesinto individual pieces has been shown. However, the invention is notlimited thereto. The (non-upper layer/lower layer-equipped) hingedlaminated bodies may be separated into individual pieces by cutting asingle part of the (non-upper layer/lower layer-equipped) layout sheetfor the hinged laminated body into external shapes of the (non-upperlayer/lower layer-equipped) hinged laminated bodies (individual pieceseparation process).

In this mode, for example, it is possible to manufacture the (upperlayer/lower layer-equipped) hinged laminated body by laminating anotherlayer (for example, an upper layer 50 and a lower layer 60) on the(non-upper layer/lower layer-equipped) hinged laminated bodycorresponding to an individual piece. In addition, the (non-upperlayer/lower layer-equipped) hinged laminated body may be used formanagement of a booklet, etc. by binding the (non-upper layer/lowerlayer-equipped) hinged laminated body corresponding to an individualpiece into the booklet without change.

In addition, when the (non-upper layer/lower layer-equipped) hingedlaminated body is bound into the booklet without being changed to the(upper layer/lower layer-equipped) hinged laminated body as describedabove, similarly to the description of the individual piece separationprocess of the 1-1st embodiment, binding may be performed in a state inwhich the (non-upper layer/lower layer-equipped) layout sheet for thehinged laminated body is not cut or in a state in which the (non-upperlayer/lower layer-equipped) layout sheet for the hinged laminated bodyis punched to form a (non-upper layer/lower layer-equipped) layout sheetfor a hinged laminated body in which a plurality of (for example, two)(non-upper layer/lower layer-equipped) hinged laminated bodies isconnected to each other, thereby performing binding and individual pieceseparation.

(2) In the embodiments, an example in which the base material layer andthe (non-upper layer/lower layer-equipped) hinged laminated body havetranslucency, and the opposite side is observable through the basematerial layer at the window portion has been shown. However, theinvention is not limited thereto. The base material layer and the(non-upper layer/lower layer-equipped) hinged laminated body may nothave translucency.

For example, the base material layer may alternatively correspond to asheet material of white, etc. having a light concealing property. Inthis case, the hologram image is observable at this window portion whenthe window portion is provided only in the upper layer. In this mode, asolid print layer of white, etc. for concealing light is unnecessary inthe base material layer.

(3) In the embodiments, an example in which the hinged laminated bodiesare arranged in both the left-right direction and the longitudinaldirection in the layout sheet for the hinged laminated body has beenshown. However, the invention is not limited thereto. It may bealternatively possible to adopt a mode in which the hinged laminatedbodies are arranged in one of the left-right direction and thelongitudinal direction in the layout sheet for the hinged laminatedbody.

(4) The laminated configuration of the hinged laminated body of theembodiments may be appropriately modified. For example, theconfiguration of FIG. 1A and FIG. 1B may be modified as below.

The print layer 51 a may not be provided on the base material layer 51,and a transparent layer printed with the same content as that of theprint layer 51 a may be laminated on the lower side of the transparentprotective layer 55 (that is, between the laser color development layer52 and the transparent protective layer 55). In this case, a securityfilm such as a hologram layer may be laminated between the laser colordevelopment layer 52 and the printed transparent layer.

The description of the above embodiments may be appropriately cited indescription of embodiments below. In particular, in many cases, aconstituent element denoted by the same reference numeral except forthousands digit substantially corresponds to the same constituentelement.

2-1st Embodiment [Configuration of Hinged Laminated Body 1010 (SinglePart)]

FIG. 11A and FIG. 11B are diagrams for description of a configuration ofa single part of a hinged laminated body 1010 of a 2-1st embodiment.

FIG. 11A is a diagram of the hinged laminated body 1010 viewed from anupper side Z2 in a thickness direction Z (that is, a normal direction ofupper surfaces of the hinged laminated body 1010 and a hinged laminatedbody 1020).

FIG. 11B is a cross-sectional view of the hinged laminated body 1010(B-B sectional view of FIG. 11A).

FIG. 11B illustrates a state in which some of layers are separated fromeach other. However, in practice, all layers are joined by thermalwelding. In addition, FIG. 11B illustrates a shape of a cut surfacepassing through an IC module 1030. Window portions 1056 and 1066, aphotograph image 1052 b of a laser color development layer 1052, etc.are not located on B-B line, but are illustrated in FIG. 11B forconvenience. This description is applied to sectional views ofsubsequent drawings.

FIG. 12A and FIG. 12B are diagrams for description of a passport 1001.

FIG. 12A is a perspective view of a state in which a page formed by thehinged laminated body 1010 is open.

FIG. 12B is a cross-sectional view of the state in which the page formedby the hinged laminated body 1010 is open (B-B sectional view of FIG.12A).

In embodiments and drawings, an XYZ orthogonal coordinate system isprovided to facilitate understanding of description. This coordinatesystem represents a left-right direction X (left side X1, right sideX2), a longitudinal direction Y (lower side Y1, upper side Y2), and athickness direction Z (lower side Z1, upper side Z2) with reference tothe state of FIG. 11A.

The hinged laminated body 1010 is bound into the passport 1001corresponding to a booklet (see FIG. 12A and FIG. 12B). That is, thehinged laminated body 1010 is used for an identification data page ofthe passport 1001 (also referred to as an IC passport, etc.)incorporating an IC chip 1032.

Use of the hinged laminated body 1010 is not limited to the passport1001, and the hinged laminated body 1010 may be used for, for example,management of a book, etc. by being bound into the book.

The (upper layer/lower layer-equipped) hinged laminated body 1010includes the (non-upper layer/lower layer-equipped) hinged laminatedbody 1020, an upper layer 1050, a lower layer 1060, and a hologram layer1070.

As illustrated in FIG. 12B, a hinge section 1041 a of the hingedlaminated body 1020 is bound together with other pages 1006 and a cover1007 using a thread 1005, etc. In this way, the hinged laminated body1010 is bound into the passport 1001.

The hinge section 1041 a of the hinged laminated body 1020 protrudes tothe right side X2 from right side surfaces of the upper layer 1050 andthe lower layer 1060. Details of the hinged laminated body 1020 will bedescribed below.

As illustrated in FIG. 11A and FIG. 11B, the upper layer 1050 islaminated on the upper side Z2 of the hinged laminated body 1020, andthe lower layer 1060 is laminated on the lower side Z1 of the hingedlaminated body 1020.

The upper layer 1050 includes a base material layer 1051, a laser colordevelopment layer 1052, a transparent protective layer 1055, and anupper layer window portion 1056. These layers are laminated in thisorder from the lower side Z1 to the upper side Z2. The base materiallayer 1051, the laser color development layer 1052, and the transparentprotective layer 1055 are formed of a colorless and transparent sheetmaterial having translucency.

The base material layer 1051 is a layer corresponding to a base materialof the hinged laminated body 1010.

The base material layer 1051 includes print layers 1051 a and 1051 c.

The print layer 1051 a is printed on an upper surface of the basematerial layer 1051 by offset printing, etc. Print content of the printlayer 1051 a is a picture, etc., and is, for example, a character, apattern, a symbol, etc. according to a specification of the passport1001. In the example of FIG. 11A and FIG. 11B, the print content of theprint layer 1051 a is character information 1051 b of “PASSPORT”,“country: AAAA”, and “NAME:”. The print content is common to all users.That is, this print content does not include individual information of auser (for example, a photograph, a name, etc. of the user).

The print layer 1051 c is solidly formed on a lower surface of the basematerial layer 1051 by silk printing, etc. Ink of the print layer 1051 cmay preferably correspond to ink which does not transmit light and has ahigh light concealing property (for example, white and highly concealingink, etc.).

The print layers 1051 a and 1051 c are not provided in a region of theupper layer window portion 1056. That is, the print layers 1051 a and1051 c are omitted in the region of the upper layer window portion 1056.

The laser color development layer 1052 contains a color developer. Forthis reason, a range of the laser color development layer 1052irradiated with laser light generates heat and develops a black color.In the embodiment, such color development is also referred to as typingor printing.

Print content of the laser color development layer 1052 is individualinformation of the user. In the example of FIG. 11A and FIG. 11B, only aphotograph image 1052 b and information “BBB CCC” of a name 1052 c ofthe user are illustrated. However, in practice, information such as adate of birth, a passport number, etc. is printed.

The material of the laser color development layer 1052 may not containthe color developer as long as color is developed by irradiation withlaser light. In addition, color development may correspond to a colorother than black.

In addition, FIG. 11A and FIG. 11B illustrate a state in which thehinged laminated body 1010 develops color to describe the print contentof the laser color development layer 1052. However, printing of thelaser color development layer 1052 may be performed after the hingedlaminated body 1010 is bound into the passport 1001.

The transparent protective layer 1055 is a protective layer forprotecting the laser color development layer 1052.

The upper layer window portion 1056 is a rectangular portion in whichthe print layers 1051 a and 1051 c are not provided. When viewed in thethickness direction Z, a region within the upper layer window portion1056 is observed to be transparent.

The lower layer 1060 includes a base material layer 1061, a transparentprotective layer 1065, and a lower layer window portion 1066. Theselayers are laminated in this order from the upper side Z2 to the lowerside Z1.

The base material layer 1061 and the transparent protective layer 1065are similar layers to the base material layer 1051 and the transparentprotective layer 1055 of the upper layer 1050. That is, a configurationof the base material layer 1061 is as follows.

The base material layer 1061 is a layer to serve as a base material ofthe hinged laminated body 1010 and includes print layers 1061 a and 1061c.

The print layer 1061 a is provided on the lower side Z1 of the basematerial layer 1061. A picture, etc. corresponding to print contentthereof, which is not illustrated, is common to all users. The printlayer 1061 c is provided on the upper side Z2 of the base material layer1061 to conceal light. The print layers 1061 a and 1061 c are omitted ina region of the lower layer window portion 1066.

The transparent protective layer 1065 is a protective layer forprotecting the base material layer 1061 and the print layer 1061 athereof.

The lower layer window portion 1066 corresponds to a rectangular regionin which the print layers 1061 a and 1061 c are not provided, and isobserved to be transparent when viewed in the thickness direction Z.

When viewed in the thickness direction Z, an external shape of the upperlayer window portion 1056 is equal to and aligned with an external shapeof the lower layer window portion 1066. The invention is not limited tothis form, and the external shape of one of the upper layer windowportion 1056 and the lower layer window portion 1066 may be larger onesize than the external shape of the other one.

The hologram layer 1070 is laminated between the hinged laminated body1020 and the upper layer 1050. When viewed from the upper side Z2, anexternal shape of the hologram layer 1070 is larger one size than thewindow portions 1056 and 1066.

The hologram layer 1070 is transparent. For example, a hologram image1071 such as a Lippmann hologram, an emboss type hologram, etc. may berecorded in the hologram layer 1070. The hologram image 1071 is disposedinside the window portions 1056 and 1066. In this connection, thehologram image 1071 may be translucent.

In the example of FIG. 11B, the hologram layer 1070 is disposed on thelower side Z1 of the upper layer window portion 1056, and thus overlapsthe upper layer window portion 1056 in the XY plane when viewed from theupper side Z2. However, the invention is not limited thereto. It ispossible to adopt a mode in which the hologram layer 1070 is disposed ata position not overlapping the upper layer window portion 1056.

In addition, in the example of FIG. 11B, the hologram layer 1070 isdisposed on the lower side Z1 of the laser color development layer 1052and the upper side Z2 of the hinged laminated body 1020. However, theinvention is not limited thereto. For example, it may be alternativelypossible to adopt a mode in which the hologram layer 1070 is disposed onthe upper side Z2 of the laser color development layer 1052.

According to this arrangement, when laser irradiation is performed totamper with printing information of the laser color development layer1052, the hologram layer 1070 on the upper side Z2 is destroyed. Forthis reason, it is possible to increase the effect of prevention offalsification.

According to the above configuration, the print content of the lasercolor development layer 1052 in the upper layer 1050 is observablethrough the transparent protective layer 1055. The print content of theprint layer 1051 a on the base material layer 1051 is observable throughthe laser color development layer 1052 and the transparent protectivelayer 1055. In addition, the print content of the print layer 1061 a onthe base material layer 1061 in the lower layer 1060 is observablethrough the transparent protective layer 1065.

In addition, since layers other than the print layers 1051 a, 1051 c,1061 a, and 1061 c have translucency, an upper surface of the hingedlaminated body 1020 is visually recognizable in the upper layer windowportion 1056 when viewed from the upper side Z2. Further, in a part ofthe window portions 1056 and 1066 in which the hologram image 1071 ofthe hologram layer 1070 is not present, the lower side Z1 of the hingedlaminated body 1020 (opposite side from an observation side) isobserved, that is, the part is observed to be colorless and transparent(see an arrow L1). In addition, in a part of the window portions 1056and 1066 in which the hologram image 1071 of the hologram layer 1070 ispresent, the hologram image 1071 is observable (see an arrow L2).

When observed from the lower side Z1, the lower surface of the hingedlaminated body 1020 is visually recognizable in the lower layer windowportion 1066. For this reason, an observation mode in the lower layerwindow portion 1066 is the same as an observation mode in the upperlayer window portion 1056.

Meanwhile, since the print layers 1051 c and 1061 c on the base materiallayers 1051 and 1061 have high light concealing property, the hingedlaminated body 1020 may not be visually recognized. For this reason, thehinged laminated body 1010 may blind a part such as an antenna 1035, andthus an appearance is excellent.

[Configuration of Hinged Laminated Body 1020 (Single Part)]

The (non-upper layer/lower layer-equipped) hinged laminated body 1020 islaminated substantially at a center of the (upper layer/lowerlayer-equipped) hinged laminated body 1010 in the thickness direction Z.

The hinged laminated body 1020 includes the IC module 1030, the antenna1035, a hinge layer 1041, a thickness adjustment layer 1042, anintermediate layer 1043 (antenna buried layer), an upper protectivelayer 1045, a lower protective layer 1046, an IC module housing hole1047, and an antenna buried groove 1048.

The lower protective layer 1046, the intermediate layer 1043, the hingelayer 1041, the thickness adjustment layer 1042, and the upperprotective layer 1045 are laminated in this order from the lower side Z1to the upper side Z2. That is, the hinge layer 1041 and the thicknessadjustment layer 1042 are laminated between the intermediate layer 1043and the upper protective layer 1045 and disposed at the same position inthe thickness direction Z.

The respective layers of the hinged laminated body 1020 are joined bythermal welding at interfaces thereof. For this reason, a sheet materialof a resin (for example, PET-G, PVC, PC, etc.) having excellentcompatibility with terminal welding is used as these materials. Theintermediate layer 1043 has a single layer structure or a multi-layerstructure of a resin sheet material. This description is applied to theupper protective layer 1045 and the lower protective layer 1046.

External shapes of the intermediate layer 1043, the lower protectivelayer 1046, and the upper protective layer 1045 are equal to oneanother. A combined external shape of two layers corresponding to thehinge layer 1041 and the thickness adjustment layer 1042 is larger thanan external shape of the intermediate layer 1043, the lower protectivelayer 1046, and the upper protective layer 1045.

The IC module 1030 includes a mounted substrate 1031 and the IC chip1032.

The mounted substrate 1031 is a substrate for mounting the IC chip 1032.A lead frame (not illustrated) of the IC chip 1032 is connected to themounted substrate 1031.

The IC chip 1032 is a semiconductor integrated circuit element andincludes a central processing unit (CPU) corresponding to a controllerand a storage device (for example, an EEPROM). Identificationinformation, etc. is stored in the storage device. The IC chip 1032 is atype performing contactless communication with an external device suchas a reader/writer.

The IC chip 1032 is mounted on a lower surface of the mounted substrate1031 and is sealed (packaged) with resin, etc.

The antenna 1035 is a winding of a covered conductive wire in a coilshape (spiral shape). The covered conductive wire is formed by coveringa periphery of the conductive wire with an insulator.

Both ends of the antenna 1035 and the lead frame of the IC chip 1032 areconnected by an electrically conductive paste, etc. In this way, theantenna 1035 and the IC chip 1032 are electrically connected to eachother.

Connection between the IC chip 1032 and the antenna 1035 is not limitedto the above-mentioned mode. For example, the lead frame of the IC chip1032 and the both ends of the antenna 1035 may be directly connected toeach other.

Communication between the IC module 1030 as well as the antenna 1035 andexternal devices includes short-range wireless communication based on anelectromagnetic induction scheme (for example, a communication schemeaccording to ISO/IEC14443, ISO/IEC15693, ISO/IEC18092, etc.).

The hinge layer 1041 is disposed only at an edge of a side on the rightside X2. That is, the hinge layer 1041 is disposed only at an edge inthe longitudinal direction Y along a right side surface corresponding toa side surface from which the hinge section 1041 a protrudes anddisposed across the entire edge in the longitudinal direction Y. Forthis reason, in the XY plane, the hinge layer 1041 is laminated only ina part of the hinged laminated body 1020.

The hinge section 1041 a is a portion bound into the passport 1001 (seeFIG. 12B).

The hinge section 1041 a protrudes from a side surface on a side boundinto the passport 1001 (a right side surface in FIG. 11A and FIG. 11B)among side surfaces of the hinged laminated body 1020.

The hinge layer 1041 has (i) sufficient flexibility for functioning as ahinge, (ii) sufficient tensile strength for preventing breaking, etc.,(iii) sufficient durability for preventing breaking even after repeatedbending, etc. For example, a layer in which a fiber such as PET,polyamide, etc. is disposed in a lattice shape between layers of aplurality of PET-G resin sheets, etc. may be used as the hinge layer1041.

The thickness adjustment layer 1042 is configured to provide anadjustment related to a thickness of the hinge layer 1041. For thisreason, a thickness of the thickness adjustment layer 1042 and thethickness of the hinge layer 1041 are the same. The thickness adjustmentlayer 1042 may be formed of the similar material as that of theintermediate layer 1043. In the left-right direction X, the thicknessadjustment layer 1042 and the hinge layer 1041 are in close contact witheach other, that is, are adjacent to each other to have almost no gap.

In addition, the thickness adjustment layer 1042 forms a part of the ICmodule housing hole 1047.

Even when the hinge layer 1041 is disposed only at the edge, the hingedlaminated body 1020 may form the upper surface and the lower surfaceflat by including the thickness adjustment layer 1042. In addition, thehinge layer 1041 of the present embodiment is provided only at the edgeof the hinged laminated body 1020, and thus has a smaller external shapewhen compared to a mode in which the hinge layer 1041 is provided on theentire surface. Even though the material for the hinge layer 1041 isexpensive, the hinged laminated body 1020 may be manufactured at lowcost by allowing the hinge layer 1041 to be small in this way.

The intermediate layer 1043 is a layer configured to provide anadjustment related to a thickness of the IC chip 1032.

The upper protective layer 1045 is a sheet material that protects the ICmodule 1030, the hinge layer 1041, etc. by being laminated on the upperside Z2 of the hinge layer 1041 and the thickness adjustment layer 1042.

Similarly, the lower protective layer 1046 is a sheet material thatprotects the IC module 1030, the intermediate layer 1043, etc. by beinglaminated on the lower side Z1 of the intermediate layer 1043.

The IC module housing hole 1047 is a hole for housing the IC module1030. The IC module housing hole 1047 is a through-hole penetrating thethickness adjustment layer 1042 and the intermediate layer 1043. Thethickness adjustment layer 1042 and the intermediate layer 1043 hold theIC module 1030 by housing the IC module 1030 in the IC module housinghole 1047. The IC module housing hole 1047 may correspond to a bottomedhole.

The antenna buried groove 1048 is a groove provided on an upper surfaceof the intermediate layer 1043. As described below, the antenna buriedgroove 1048 is formed by burying the antenna 1035 using hot pressing ina state in which the antenna 1035 is disposed. For this reason, whenviewed from the upper side Z2, arrangement of the antenna buried groove1048 is the same as arrangement of the antenna 1035. The thicknessadjustment layer 1042 is laminated immediately above the intermediatelayer 1043. For this reason, the intermediate layer 1043 houses theantenna 1035 in the antenna buried groove 1048, and the thicknessadjustment layer 1042 covers an opening of the antenna buried groove1048. In this way, the thickness adjustment layer 1042 and theintermediate layer 1043 may hold the antenna 1035.

[Layout Sheet for Hinged Laminated Body 1010A]

FIG. 13A and FIG. 13B are diagrams for description of a configuration ofa layout sheet for the hinged laminated body 1010A of the 2-1stembodiment.

FIG. 13A is a diagram of the layout sheet for the hinged laminated body1010A viewed from the upper side Z2 in the thickness direction Z (normaldirection of the upper surface).

FIG. 13B is a cross-sectional view of the layout sheet for the hingedlaminated body 1010A (B-B sectional view of FIG. 13A).

In the figures, a cut portion 2 of punching by pressing (that is, theexternal shape of the hinged laminated body 1010) is indicated by atwo-dot chain line.

The (upper layer/lower layer-equipped) layout sheet for the hingedlaminated body 1010A is a sheet material in which a plurality of (upperlayer/lower layer-equipped) hinged laminated bodies 1010 is arranged.

When viewed from the upper side Z2, a total of four hinged laminatedbodies 1010 are arranged, two in the longitudinal direction Y and two inthe left-right direction X. The number of the hinged laminated bodies1010 in the longitudinal direction Y may be appropriately set accordingto convenience in manufacturing. In addition, FIG. 13A and FIG. 13Billustrate an example in which a space 1003 (blank) is provided betweenthe hinged laminated bodies 1010. However, the space 1003 may be deletedas appropriate.

A laminated configuration of the layout sheet for the hinged laminatedbody 1010A corresponds to a laminated configuration of the hingedlaminated body 1010.

That is, in the (upper layer/lower layer-equipped) layout sheet for thehinged laminated body 1010A, a transparent protective layer sheetmaterial 1065A, a base material layer sheet material 1061A, a (non-upperlayer/lower layer-equipped) layout sheet for a hinged laminated body1020A, the hologram layer 1070, a base material layer sheet material1051A, a laser color development layer sheet material 1052A, and atransparent protective layer sheet material 1055A are laminated in thisorder from the lower side Z1 to the upper side Z2.

The base material layer sheet material 1051A, the laser colordevelopment layer sheet material 1052A, and the transparent protectivelayer sheet material 1055A correspond to a sheet material (upper layerlayout sheet) in which four members forming the upper layer 1050 arearranged in the XY plane direction.

That is, the base material layer sheet material 1051A corresponds to asheet material in which four base material layers 1051 are arranged inthe XY plane direction. In addition, the laser color development layersheet material 1052A and the transparent protective layer sheet material1055A correspond to sheet materials in which four laser colordevelopment layers 1052 and four transparent protective layers 1055 arearranged in the XY plane direction, respectively. Arrangement of thefour members of each sheet material corresponds to arrangement of fourhinged laminated bodies 1020 of the layout sheet for the hingedlaminated body 1020A (see FIG. 14A and FIG. 14B).

Similarly, the base material layer sheet material 1061A and thetransparent protective layer sheet material 1065A correspond to a sheetmaterial (lower layer layout sheet) in which four members forming thelower layer 1060 are arranged in the XY plane direction at positionscorresponding to the hinged laminated bodies 1020 of the layout sheetfor the hinged laminated body 1020A.

External shapes of the base material layer sheet materials 1051A and1061A, the laser color development layer sheet material 1052A, and thetransparent protective layer sheet materials 1055A and 1065A are equalto one another. Left and right hinge sections 1041 a protrude from leftand right side surfaces of the layout sheet for the hinged laminatedbody 1020A in a state of the layout sheet for the hinged laminated body1010A.

[Layout Sheet for Hinged Laminated Body 1020A]

FIG. 14A and FIG. 14B are diagrams for description of a configuration ofthe layout sheet for the hinged laminated body 1020A of the 2-1stembodiment.

FIG. 14A is a diagram of the layout sheet for the hinged laminated body1020A viewed from the upper side Z2 in the thickness direction Z (normaldirection of the upper surface).

FIG. 14B is a cross-sectional view of the layout sheet for the hingedlaminated body 1020A (B-B sectional view of FIG. 14A).

The (non-upper layer/lower layer-equipped) layout sheet for the hingedlaminated body 1020A is a sheet material in which a plurality of(non-upper layer/lower layer-equipped) hinged laminated bodies 1020 isarranged.

Arrangement of the hinged laminated bodies 1020 of the layout sheet forthe hinged laminated body 1020A is the same as that of the layout sheetfor the hinged laminated body 1010A.

That is, when viewed from the upper side Z2, a total of four hingedlaminated bodies 1020 are arranged, two in the longitudinal direction Yand two in the left-right direction X. In the hinged laminated body 1020on the left side X1, the hinge section 1041 a is disposed on the leftside X1. Meanwhile, in the hinged laminated body 1020 on the right sideX2, the hinge section 1041 a is disposed on the right side X2. The twohinged laminated bodies 1020 on the left side X1 and the two hingedlaminated bodies 1020 on the right side X2 are disposedpoint-symmetrically with respect to the layout sheet for the hingedlaminated body 1020A. The number of hinged laminated bodies 1020 in thelongitudinal direction Y and the space 1003 may be modified similarly tothe layout sheet for the hinged laminated body 1010A.

The left and right hinge sections 1041 a protrude from the left andright side surfaces of the layout sheet for the hinged laminated body1020A in a state of the layout sheet for the hinged laminated body1020A.

A laminated configuration of the layout sheet for the hinged laminatedbody 1020A corresponds to a laminated configuration of the hingedlaminated body 1020.

That is, in the layout sheet for the hinged laminated body 1020A, alower protective layer sheet material 1046A, an intermediate layer sheetmaterial 1043A, a hinge layer sheet material 1041A, a thicknessadjustment layer sheet material 1042A, and an upper protective layersheet material 1045A are laminated in this order from the lower side Z1to the upper side Z2.

The hinge layer sheet material 1041A is laminated on each of left andright sides. When viewed in the thickness direction Z (that is, in theXY plane), in one hinge layer sheet material 1041A, two hinge layers1041 are arranged in the longitudinal direction Y at positionscorresponding to arrangement of the layout sheet for the hingedlaminated body 1020A.

The thickness adjustment layer sheet material 1042A is a sheet materialin which four thickness adjustment layers 1042 are arranged at positionscorresponding to arrangement of the layout sheet for the hingedlaminated body 1020A. When viewed in the thickness direction Z, thethickness adjustment layer sheet material 1042A is disposed between andin close contact with the left and right hinge layer sheet materials1041A in the left-right direction X.

Similarly, the intermediate layer sheet material 1043A, the upperprotective layer sheet material 1045A, and the lower protective layersheet material 1046A are sheet materials in which members of fourintermediate layers 1043, four upper protective layers 1045, and fourlower protective layers 1046 are arranged, respectively.

[Manufacturing Method]

FIG. 15A to FIG. 15F are cross-sectional views for description of amethod of manufacturing the layout sheet for the hinged laminated body1020A of the 2-1st embodiment.

(Method of Manufacturing Layout Sheet for Hinged Laminated Body 1020A)

When the layout sheet for the hinged laminated body 1020A ismanufactured, the hinge layer sheet material 1041A, the thicknessadjustment layer sheet material 1042A, the intermediate layer sheetmaterial 1043A, the upper protective layer sheet material 1045A, and thelower protective layer sheet material 1046A are manufactured in advancein a previous process thereof. A hole is provided by punching in each ofthe thickness adjustment layer sheet material 1042A (see FIG. 15C) andthe intermediate layer sheet material 1043A (see FIG. 15A). The holeforms the IC module housing hole 1047.

The layout sheet for the hinged laminated body 1020A may be manufacturedaccording to the following processes.

(1) Formation Process of Antenna 1035

As illustrated in FIG. 15A, in a state in which the antenna 1035 isdisposed in a coil shape on an upper surface of the intermediate layersheet material 1043A, the antenna 1035 is buried in the intermediatelayer sheet material 1043A by hot pressing. In this way, the antennaburied groove 1048 is formed on the upper surface of the intermediatelayer sheet material 1043A, and the antenna 1035 is buried therein.

(2) Connection Process of IC Module 1030 and Antenna 1035

As illustrated in FIG. 15B, the IC module 1030 is housed in the ICmodule housing hole 1047 of the intermediate layer sheet material 1043A.In addition, the mounted substrate 1031 and the both ends of the antenna1035 are electrically and mechanically connected by an electricallyconductive paste, etc.

(3) Lamination Process of Thickness Adjustment Layer Sheet Material1042A

As illustrated in FIG. 15C, hot pressing is performed in a state inwhich the thickness adjustment layer sheet material 1042A and theintermediate layer sheet material 1043A are laminated.

In this way, the thickness adjustment layer sheet material 1042A and theintermediate layer sheet material 1043A are thermally welded at theinterface thereof. In addition, the thickness adjustment layer sheetmaterial 1042A holds the antenna 1035 by covering an opening of theantenna buried groove 1048.

Here, when the thickness adjustment layer sheet material 1042A and theintermediate layer sheet material 1043A are laminated, positioning maybe performed such that centers of IC module housing holes 1047 of thetwo sheet materials coincide with each other. For this reason, thispositioning process is easily performed.

(4) Lamination Process of Hinge Layer Sheet Material 1041A

As illustrated in FIG. 15D, the hinge layer sheet material 1041A islaminated on each of left and right sides of a laminate produced inprocesses up to the above process (3).

In this case, positioning of the hinge layer sheet material 1041A andthe thickness adjustment layer sheet material 1042A in the left-rightdirection X is easily performed since it suffices to bring a sidesurface of the hinge layer sheet material 1041A and a side surface thethickness adjustment layer sheet material 1042A into contact with eachother (see an arrow D).

The embodiment shows an example in which thermal welding of the hingelayer sheet material 1041A and the intermediate layer sheet material1043A is performed together with other sheet materials in process (5)below. However, only the hinge layer sheet material 1041A and theintermediate layer sheet material 1043A may be thermally welded in thisprocess (4).

(5) Hot Pressing Process

As illustrated in FIG. 15E and FIG. 15F, hot pressing is performed in astate in which the upper protective layer sheet material 1045A and thelower protective layer sheet material 1046A are laminated with respectto a laminate produced in processes up to the above process (4). In thisway, the respective layers are thermally welded at interfaces thereof.

As described above, it is possible to manufacture the layout sheet forthe hinged laminated body 1020A.

(Method of Manufacturing Layout Sheet for Hinged Laminated Body 1010Aand Hinged Laminated Body 1010)

When the layout sheet for the hinged laminated body 1010A ismanufactured, the layout sheet for the hinged laminated body 1020A, thebase material layer sheet materials 1051A and 1061A, the laser colordevelopment layer sheet material 1052A, the transparent protective layersheet materials 1055A and 1065A, and the hologram layer 1070 aremanufactured in advance in a previous process thereof.

The layout sheet for the hinged laminated body 1010A may be manufacturedaccording to the following processes.

(1) Lamination Process of Upper Layer 1050 (Upper Layer LaminationProcess)

The hologram layer 1070, the base material layer sheet material 1051A,the laser color development layer sheet material 1052A, and thetransparent protective layer sheet material 1055A are laminated on theupper side Z2 of the layout sheet for the hinged laminated body 1020A(see FIG. 13B).

(2) Lamination Process of Lower Layer 1060 (Lower Layer LaminationProcess)

The base material layer sheet material 1061A and the transparentprotective layer sheet material 1065A are laminated on the lower side Z1of the layout sheet for the hinged laminated body 1020A (see FIG. 13B).

(3) Hot Pressing Process

Hot pressing is performed in a state in which the respective members arelaminated in the above processes (1) and (2). In this way, therespective layers are thermally welded at interfaces thereof.

Through the processes so far, it is possible to manufacture the layoutsheet for the hinged laminated body 1010A in which the hinged laminatedbodies 1010 are arranged.

(4) Individual Piece Separation Process

Separation into individual pieces is performed by cutting the layoutsheet for the hinged laminated body 1010A thermally welded in the aboveprocess (3) into external shapes of the respective hinged laminatedbodies 1010 through punching. In this way, the four hinged laminatedbodies 1010 are manufactured.

In this case, a shape of a cut portion 1002 of each hinged laminatedbody 1010 is a U-shape in which the hinge section 1041 a side is open(see FIG. 13A). In this way, the hinge section 1041 a remains in eachhinged laminated body 1010.

In this way, it is possible to manufacture the hinged laminated body1010 in which the hinge section 1041 a protrudes from a part of a sidesurface by cutting the layout sheet for the hinged laminated body 1010A(that is, the layout sheet for the hinged laminated body 1020A) suchthat four hinge sections 1041 a remain. For this reason, it is possibleto simultaneously manufacture a plurality of hinged laminated bodies1010 similarly to conventional card manufacture. In this way, the hingedlaminated body 1010 may be manufactured easily and at low cost.

The hinged laminated body 1010 after individual piece separation isprocessed into the passport 1001 by binding the hinge section 1041 a(see FIG. 12A and FIG. 12B). In addition, after (or before) beingprocessed into the passport 1001, the hinged laminated body 1010 afterindividual piece separation is irradiated with laser light, therebybeing printed with individual information of the user (the photographimage 1052 b, the name 1052 c, etc.) (see FIG. 11A).

In a state in which the layout sheet for the hinged laminated body 1010Ais not cut or in a state in which the layout sheet for the hingedlaminated body 1010A is cut in a form of a layout sheet for a hingedlaminated body in which a plurality of (for example, two) hingedlaminated bodies 1010 is connected to each other, binding may beperformed in a mode in which a plurality of passports is arranged(so-called multiple layout). In this case, after binding, the layoutsheet for the hinged laminated body 1010A is separated into individualpieces corresponding to the hinged laminated bodies 1010 by separatingthe passport into individual pieces.

In this case, separation into individual pieces corresponding to thehinged laminated bodies 1010 may be performed after binding, and thus abinding process may be performed according to a specification of abinding machine, convenience in manufacturing, etc.

As described above, in the hinged laminated body 1020 of the presentembodiment, the hinge layer 1041 and the thickness adjustment layer 1042are disposed at the same lamination position in the thickness directionZ, and the thickness adjustment layer 1042 forms a layer for holding theelectrical component. For this reason, a thickness of the hingedlaminated body 1020 is smaller when compared to a mode in which a hingelayer is newly laminated on a card-shaped medium having an electricalcomponent. In this way, it is possible to reduce thicknesses of thehinged laminated body 1020 and the hinged laminated body 1010.

2-2nd Embodiment

Next, a description will be given of a 2-2nd embodiment of theinvention.

In the following description and drawings, a portion having the samefunction as that of the above-described 2-1st embodiment will beappropriately denoted by the same reference numeral or the same suffix(last two digits), and a repeated description will be appropriatelyomitted. In addition, in the following description and drawings, aconfiguration of a hinged laminated body will be mainly described, and aconfiguration of a layout sheet for the hinged laminated body in which aplurality of hinged laminated bodies is arranged will not be described.The hinged laminated body may be manufactured by separating the layoutsheet for the hinged laminated body having a laminated configurationcorresponding to laminated configurations of these hinged laminatedbodies into individual pieces.

FIG. 16 is a cross-sectional view of a hinged laminated body 1210 of the2-2nd embodiment.

As illustrated in FIG. 16, an antenna 1035 of a hinged laminated body1220 of the present embodiment is buried in a thickness adjustment layer1242. Arrangement of the thickness adjustment layer 1242 and a hingelayer 1241 is the same as that in the 2-1st embodiment.

The thickness adjustment layer 1242 includes an antenna buried groove1248 in which the antenna 1035 is buried.

The antenna buried groove 1248 is provided on a lower surface of thethickness adjustment layer 1242. An intermediate layer 1043 is providedimmediately below the thickness adjustment layer 1242.

For this reason, the thickness adjustment layer 1242 houses the antenna1035 in the antenna buried groove 1248, and the intermediate layer 1043covers an opening of the antenna buried groove 1248. In this way, thethickness adjustment layer 1242 and the intermediate layer 1043 hold theantenna 1035.

The antenna buried groove 1248 of the thickness adjustment layer 1242may be formed similarly to a method of forming an antenna housing grooveon the intermediate layer in the 2-1st embodiment (see FIG. 15A). Thatis, hot pressing may be performed in a state in which the antenna 1035is disposed on a lower surface of a thickness adjustment layer sheetmaterial.

As described above, similarly to the 2-1st embodiment, the thicknessadjustment layer 1242 of the present embodiment forms a layer forholding the electrical component such as the antenna 1035. In addition,the hinge layer 1241 and the thickness adjustment layer 1242 arelaminated at the same position in the thickness direction Z. For thisreason, it is possible to reduce thicknesses of the hinged laminatedbody 1220 and the hinged laminated body 1210.

2-3rd Embodiment

Next, a description will be given of a 2-3rd embodiment of theinvention.

FIG. 17 is a cross-sectional view of a hinged laminated body 1310 of the2-3rd embodiment.

As illustrated in FIG. 17, in a hinged laminated body 1320 of thepresent embodiment, a lower protective layer 1046, an intermediate layer1043, an intermediate layer 1349, a hinge layer 1341, and a thicknessadjustment layer 1342 are laminated in this order from a lower side Z1to an upper side Z2.

For this reason, as an uppermost layer of the hinged laminated body1320, the hinge layer 1341 and the thickness adjustment layer 1342 arelaminated instead of an upper protective layer.

The intermediate layer 1349 may be formed of the same resin sheetmaterial as that of the intermediate layer 1043. Similarly to thethickness adjustment layer of the 2-1st embodiment, the intermediatelayer 1349 holds an antenna 1035 by covering an antenna buried groove1048 of the intermediate layer 1043. In addition, the intermediate layer1349 and the intermediate layer 1043 form an IC module housing hole 1347for housing an IC module 1030.

The thickness adjustment layer 1342 is laminated immediately above theintermediate layer 1349, and thus covers an opening of the IC modulehousing hole 1347. In this way, the thickness adjustment layer 1342, theintermediate layer 1043, and the intermediate layer 1349 may hold the ICmodule 1030.

As described above, the hinge layer 1341 and the thickness adjustmentlayer 1342 of the present embodiment are laminated as the uppermostlayer of the hinged laminated body 1320, and the thickness adjustmentlayer 1342 forms a layer for holding the IC module 1030. For thisreason, the hinged laminated body 1320 does not require the upperprotective layer. In this way, it is possible to reduce thicknesses ofthe hinged laminated body 1320 and the hinged laminated body 1310.

2-4th Embodiment

Next, a description will be given of a 2-4th embodiment of theinvention.

FIG. 18 is a cross-sectional view of a hinged laminated body 1410 of the2-4th embodiment.

As illustrated in FIG. 18, in a hinged laminated body 1420 of thepresent embodiment, a hinge layer 1441, a thickness adjustment layer1442, an intermediate layer 1043, an intermediate layer 1449, and anupper protective layer 1045 are laminated in this order from a lowerside Z1 to an upper side Z2.

For this reason, as a lowermost layer of the hinged laminated body 1420,the hinge layer 1441 and the thickness adjustment layer 1442 arelaminated instead of a lower protective layer. That is, while the hingelayer and the thickness adjustment layer of the 2-3rd embodiment arelaminated as the uppermost layer of the hinged laminated body, the hingelayer 1441 and the thickness adjustment layer 1442 of the presentembodiment are laminated as the lowermost layer of the hinged laminatedbody 1420.

Similarly to the 2-3rd embodiment, the intermediate layer 1449 and theintermediate layer 1043 form an IC module housing hole 1447 for housingan IC module 1030.

The thickness adjustment layer 1442 is laminated immediately below theintermediate layer 1043, and thus covers an opening on the lower side Z1of the IC module housing hole 1447. In this way, the thicknessadjustment layer 1442, the intermediate layer 1043, and the intermediatelayer 1449 may hold the IC module 1030.

As described above, the hinged laminated body 1420 of the presentembodiment does not require the lower protective layer, and thus it ispossible to reduce thicknesses of the hinged laminated body 1410 and thehinged laminated body 1420 similarly to the 2-3rd embodiment.

2-5th Embodiment

Next, a description will be given of a 2-5th embodiment of theinvention.

FIG. 19 is a cross-sectional view of a hinged laminated body 1510 of the2-5th embodiment.

As illustrated in FIG. 19, in a hinged laminated body 1520 of thepresent embodiment, a lower protective layer 1046, a hinge layer 1541, athickness adjustment layer 1542, an intermediate layer 1543, and anupper protective layer 1045 are laminated in this order from a lowerside Z1 to an upper side Z2. For this reason, an IC module housing hole1047 penetrates the intermediate layer 1543 and the thickness adjustmentlayer 1542 in this order from the upper side Z2. In addition, an antennaburied groove 1048 is provided on an upper surface of the thicknessadjustment layer 1542.

Similarly to the 2-1st embodiment, the antenna buried groove 1048 may beformed by hot-pressing in a state in which the antenna 1035 is disposedon an upper surface of a thickness adjustment layer sheet material.

In this way, a laminated configuration of the hinged laminated body 1520may be modified according to a specification, etc.

Modifications

(1) In the 2-1st to 2-5th embodiments, an example in which the (upperlayer/lower layer-equipped) layout sheet for the hinged laminated bodyis cut to separate the (upper layer/lower layer-equipped) hingedlaminated bodies into individual pieces has been shown. However, theinvention is not limited thereto. The (non-upper layer/lowerlayer-equipped) hinged laminated bodies may be separated into individualpieces by cutting a single part of the (non-upper layer/lowerlayer-equipped) layout sheet for the hinged laminated body into externalshapes of the (non-upper layer/lower layer-equipped) hinged laminatedbodies (individual piece separation process).

In this mode, for example, it is possible to manufacture the (upperlayer/lower layer-equipped) hinged laminated body by laminating anotherlayer (for example, the upper layer 50 and the lower layer 60) on the(non-upper layer/lower layer-equipped) hinged laminated bodycorresponding to an individual piece. In addition, the (non-upperlayer/lower layer-equipped) hinged laminated body may be used as is formanagement of a booklet, etc. by binding the (non-upper layer/lowerlayer-equipped) hinged laminated body corresponding to an individualpiece into the booklet.

(2) In the embodiments, an example in which the base material layer andthe (non-upper layer/lower layer-equipped) hinge layer for the hingedlaminated body and/or the intermediate layer (thickness adjustmentlayer) have translucency, and the opposite side is observable throughthe base material layer in the window portion has been shown. However,the invention is not limited thereto. The base material layer and the(non-upper layer/lower layer-equipped) hinged laminated body mayalternatively not have translucency.

For example, the base material layer may correspond to a sheet materialof white, etc. having a light concealing property. In this case, whenthe window portion is provided only in the upper layer, the hologramimage is observable in this window portion. In this mode, a solid printlayer of white, etc. for concealing light is unnecessary in the basematerial layer.

(3) In the embodiments, an example in which the hinged laminated bodiesare arranged in both the left-right direction and the longitudinaldirection in the layout sheet for the hinged laminated body has beenshown. However, the invention is not limited thereto. It may be possiblealternatively to adopt a mode in which the hinged laminated bodies arearranged in one of the left-right direction and the longitudinaldirection in the layout sheet for the hinged laminated body.

(4) The laminated configuration of the hinged laminated body of theembodiments may be appropriately modified. For example, theconfiguration of FIG. 11A and FIG. 11B may be modified as below.

The print layer 1051 a may not be provided on the base material layer1051, and a transparent layer printed with the same content as that ofthe print layer 1051 a may be alternatively laminated on the lower sideof the transparent protective layer 1055 (that is, between the lasercolor development layer 1052 and the transparent protective layer 1055).In this case, a security film such as a hologram layer may be laminatedbetween the laser color development layer 1052 and the printedtransparent layer.

The description of the above embodiments may be appropriately cited indescription of embodiments below. In particular, in many cases, aconstituent element denoted by the same reference numeral except forthousands digit substantially corresponds to the same constituentelement.

3-1st Embodiment

FIG. 20A and FIG. 20B are diagrams for description of a layout sheet fora hinged laminated body 2010A of a 3-1st embodiment.

FIG. 20A is a diagram of the layout sheet for the hinged laminated body2010A viewed from an upper side Z2 in a thickness direction Z (a normaldirection of an upper surface).

FIG. 20B is a cross-sectional view of the layout sheet for the hingedlaminated body 2010A (B-B sectional view of FIG. 20A).

In embodiments and drawings, an XYZ orthogonal coordinate system isprovided to facilitate understanding of description. This coordinatesystem represents a left-right direction X (left side X1, right sideX2), a longitudinal direction Y (lower side Y1, upper side Y2), and athickness direction Z (lower side Z1, upper side Z2) with reference tothe state of FIG. 20A.

In addition, a configuration of the thickness direction Z is illustratedin an exaggerated manner to clearly illustrate the configuration. A cutportion 2002 of punching by pressing (that is, an external shape of ahinged laminated body 2010) is indicated by a two-dot chain line.

The (upper layer/lower layer-equipped) layout sheet for the hingedlaminated body 2010A is a sheet material in which a plurality of (upperlayer/lower layer-equipped) hinged laminated bodies 2010 is arranged.

As described below, the (upper layer/lower layer-equipped) layout sheetfor the hinged laminated body 2010A is manufactured by laminating a(non-upper layer/lower layer-equipped) layout sheet for a hingedlaminated body 2020A, sheet materials included in an upper layer 2050,and sheet materials included in a lower layer 2060. Thereafter, thelayout sheet for the hinged laminated body 2010A is cut into individualpieces corresponding to the hinged laminated bodies 2010.

The hinged laminated body 2010 includes an IC chip 2032 for storingsecurity information. The hinged laminated body 2010 made into anindividual piece is bound into a passport 2001 as a booklet. That is,the hinged laminated body 2010 is used for an identification data pageof the passport 2001 (also referred to as an IC passport, etc.)incorporating the IC chip 2032.

Use of the hinged laminated body 2010 is not limited to the passport2001, and the hinged laminated body 2010 may be used for, for example,management of a book, etc. by being bound into the book.

[Configuration of Single Part of Hinged Laminated Body 2020]

FIG. 21A and FIG. 21B are diagrams for description of a configuration ofa single part of a hinged laminated body 2020 of the 3-1st embodiment.

FIG. 21A is a diagram of the hinged laminated body 2020 viewed from theupper side Z2 in the thickness direction Z (the normal direction of theupper surface).

FIG. 21B is a cross-sectional view (B-B sectional view of FIG. 21A) ofthe hinged laminated body 2020.

The hinged laminated body 2020 is laminated substantially at a center ofthe hinged laminated body 2010 in the thickness direction Z (see FIG.23A and FIG. 23B).

The hinged laminated body 2020 includes an IC module 2030, an antenna2035, a hinge layer 2041, an intermediate layer 2042, an upperprotective layer 2045, and a lower protective layer 2046.

The lower protective layer 2046, the intermediate layer 2042, the hingelayer 2041, and the upper protective layer 2045 are laminated in thisorder from the lower side Z1 to the upper side Z2. These layers arejoined by thermal welding at interfaces thereof. For this reason, asheet material of a resin (for example, PET-G, PVC, etc.) havingexcellent compatibility with terminal welding is used as thesematerials. The intermediate layer 2042 has a single layer structure or amulti-layer structure of a resin sheet material. This description isapplied to the upper protective layer 2045 and the lower protectivelayer 2046.

External shapes of the intermediate layer 2042, the lower protectivelayer 2046, and the upper protective layer 2045 are equal to oneanother. An external shape of the hinge layer 2041 is larger than theexternal shapes of the intermediate layer 2042, the lower protectivelayer 2046, and the upper protective layer 2045. This dimensionallyexceeding part of the hinge layer 2041 constitutes a hinge section 2041a.

The IC module 2030 includes a mounted substrate 2031 and an IC chip2032.

The mounted substrate 2031 is a substrate for mounting the IC chip 2032.A lead frame (not illustrated) of the IC chip 2032 is connected to themounted substrate 2031.

The IC chip 2032 is a semiconductor integrated circuit element andincludes a central processing unit (CPU) corresponding to a controllerand a storage device (for example, an EEPROM). Identificationinformation, etc. is stored in the storage device. The IC chip 2032 is atype performing contactless communication with an external device suchas a reader/writer.

The IC chip 2032 is mounted on a lower surface of the mounted substrate2031 and is sealed (packaged) with resin, etc.

The antenna 2035 is a winding of a covered conductive wire in a coilshape (spiral shape). The covered conductive wire is formed by coveringa periphery of the conductive wire with an electrical insulator.

Both ends of the antenna 2035 and the lead frame of the IC chip 2032 areconnected by an electrically conductive paste, etc. In this way, theantenna 2035 and the IC chip 2032 are electrically connected to eachother.

Connection between the IC chip 2032 and the antenna 2035 is not limitedto the above-mentioned mode. For example, the lead frame of the IC chip2032 and the both ends of the antenna 2035 may be directly connected toeach other.

Communication between the IC module 2030 as well as the antenna 2035 andthe external device corresponds to short-range wireless communicationbased on an electromagnetic induction scheme (for example, acommunication scheme according to ISO/IEC14443, ISO/IEC15693,ISO/IEC18092, etc.).

The hinge layer 2041 is larger than external shapes of other layers2042, 2045, and 2046 of the hinged laminated body 2020.

The hinge layer 2041 includes the hinge section 2041 a.

The hinge section 2041 a is a portion bound into the passport 2001 (seeFIG. 22B).

The hinge section 2041 a protrudes from a side surface on a side boundinto the passport 2001 (a right side surface in FIG. 21A and FIG. 21B)among side surfaces of the hinged laminated body 2020.

The hinge layer 2041 has sufficient flexibility for functioning as ahinge, sufficient tensile strength for preventing breaking, etc.,sufficient durability for preventing breaking even after repeatedbending, etc. For example, a layer in which a fiber such as PET,polyamide, etc. is disposed in a lattice shape between layers of aplurality of PET-G resin sheets, etc. may be used as the hinge layer2041.

The intermediate layer 2042 is a layer for providing an adjustmentrelated to a thickness of the IC chip 2032.

The upper protective layer 2045 is a sheet material that protects the ICmodule 2030, the hinge layer 2041, etc. by being laminated on the upperside Z2 of the hinge layer 2041.

Similarly, the lower protective layer 2046 is a sheet material thatprotects the IC module 2030, the intermediate layer 2042, etc. by beinglaminated on the lower side Z1 of the intermediate layer 2042.

[Mode of Layout Sheet for Hinged Laminated Body 2020A]

FIG. 22A and FIG. 22B are diagrams for description of a configuration ofthe layout sheet for the hinged laminated body 2020A of the 3-1stembodiment.

FIG. 22A is a diagram of the layout sheet for the hinged laminated body2020A viewed from the upper side Z2 in the thickness direction Z (normaldirection of the upper surface).

FIG. 22B is a cross-sectional view of the layout sheet for the hingedlaminated body 2020A (B-B sectional view of FIG. 22A).

The (non-upper layer/lower layer-equipped) layout sheet for the hingedlaminated body 2020A is a sheet material in which a plurality of(non-upper layer/lower layer-equipped) hinged laminated bodies 2020 isarranged.

When the layout sheet for the hinged laminated body 2020A is viewed fromthe upper side Z2, a total of four hinged laminated bodies 2020 arearranged, two in the longitudinal direction Y and two in the left-rightdirection X. The number of the hinged laminated bodies 2020 in thelongitudinal direction Y may be appropriately set according toconvenience in manufacturing. In addition, FIG. 22A and FIG. 22Billustrate an example in which a space 2003 (blank) is provided betweenadjacent hinged laminated bodies 2020. However, the space 2003 may bedeleted as appropriate.

In a hinged laminated body 2020 on the left side X1, a hinge section2041 a is disposed on the left side X1. Meanwhile, in a hinged laminatedbody 2020 on the right side X2, a hinge section 2041 a is disposed onthe right side X2. Two hinged laminated bodies 2020 on the left side X1and two hinged laminated bodies 2020 on the right side X2 arepoint-symmetrically disposed.

According to the above configuration, in two hinged laminated bodies2020 (2020-1 and 2020-3) adjacent to each other in the left-rightdirection X, hinge sections 2041 a thereof are disposed on oppositesides of the layout sheet for the hinged laminated body 2020A. Thisdescription is applied to two hinged laminated bodies 2020 (2020-2 and2020-4) adjacent to each other in the left-right direction X.

In addition, in two hinged laminated bodies 2020 (2020-1 and 2020-2)adjacent to each other in the longitudinal direction Y, hinge sections2041 a thereof are disposed along a right side (at least one side) ofthe layout sheet for the hinged laminated body 2020A. Similarly, in twohinged laminated bodies 2020 (2020-3 and 2020-4) adjacent to each otherin the longitudinal direction Y, hinge sections 2041 a thereof aredisposed along a left side (at least one side) of the layout sheet forthe hinged laminated body 2020A.

A laminated configuration of the layout sheet for the hinged laminatedbody 2020A corresponds to a laminated configuration of the hingedlaminated body 2020.

That is, in the layout sheet for the hinged laminated body 2020A, alower protective layer sheet material 2046A, an intermediate layer sheetmaterial 2042A, a hinge layer sheet material 2041A, and an upperprotective layer sheet material 2045A are laminated in this order fromthe lower side Z1 to the upper side Z2.

The hinge layer sheet material 2041A is a sheet material in which fourhinge layers 2041 are arranged in the XY plane direction. Similarly, theintermediate layer sheet material 2042A, the upper protective layersheet material 2045A, and the lower protective layer sheet material2046A are sheet materials in which members of four intermediate layers2042, four upper protective layers 2045, and four lower protectivelayers 2046 are arranged, respectively. Arrangement of the four membersof each of the sheet materials corresponds to arrangement of the fourhinged laminated bodies 2020 of the layout sheet for the hingedlaminated body 2020A.

External shapes of the intermediate layer sheet material 2042A, theupper protective layer sheet material 2045A, and the lower protectivelayer sheet material 2046A (hereinafter also referred to as other sheetmaterials 2042A, 2045A, and 2046A) are equal to one another.

An external shape of the hinge layer sheet material 2041A is larger thanthe external shapes of other sheet materials 2042A, 2045A, and 2046A.

For this reason, the hinge layer sheet material 2041A is laminated onthe entire surface of the layout sheet for the hinged laminated body2020A. A part of the external shape of the hinge layer sheet material2041A exceeding the other sheet materials 2042A, 2045A, and 2046A islaminated in a state of protruding from left and right side surfaces.Left and right protruding lengths are equal to each other. A length ofthe hinge layer sheet material 2041A in the longitudinal direction Y isthe same as lengths of the other sheet materials 2042A, 2045A, and2046A.

[Configuration of Single Part of Hinged Laminated Body 2010]

FIG. 23A and FIG. 23B are diagrams for description of a configuration ofa single part of a hinged laminated body 2010 of the 3-1st embodiment.

FIG. 23A is a diagram of the hinged laminated body 2010 viewed from theupper side Z2 in the thickness direction Z (a normal direction of anupper surface).

FIG. 23B is a cross-sectional view (B-B sectional view of FIG. 23A) ofthe hinged laminated body 2010.

FIG. 23A and FIG. 23B illustrate a state in which the hinged laminatedbody 2010 develops color to describe print content of a laser colordevelopment layer 2052. FIG. 23B is a cross-sectional view passingthrough an IC module 2030 and illustrates color development of the lasercolor development layer 2052. Printing of the laser color developmentlayer 2052 may be performed after the hinged laminated body 2010 isbound into the passport 2001.

FIG. 24A and FIG. 24B are diagrams for description of the passport 2001of the 3-1st embodiment.

FIG. 24A is a perspective view of a state in which a page formed by thehinged laminated body 2010 is open.

FIG. 24B is a cross-sectional view (B-B sectional view of FIG. 24A) ofthe state in which the page formed by the hinged laminated body 2010 isopen.

The (upper layer/lower layer-equipped) hinged laminated body 2010includes the (non-upper layer/lower layer-equipped) hinged laminatedbody 2020, the upper layer 2050, and the lower layer 2060.

As illustrated in FIG. 24A and FIG. 24B, a hinge section 2041 a of thehinged laminated body 2020 is bound together with other pages 2006 and acover 2007 using a thread 2005, etc. In this way, the hinged laminatedbody 2010 is bound into the passport 2001.

As illustrated in FIG. 23A and FIG. 23B, the upper layer 2050 islaminated on the upper side Z2 of the hinged laminated body 2020, andthe lower layer 2060 is laminated on the lower side Z1 of the hingedlaminated body 2020.

External shapes of the upper layer 2050 and the lower layer 2060 areequal to external shapes of other sheet materials 2042A, 2045A, and2046A of the hinged laminated body 2020. For this reason, the hingesection 2041 a of the hinged laminated body 2020 protrudes to the rightside X2 from right side surfaces of these layers even in a state of thehinged laminated body 2010.

The upper layer 2050 includes a base material layer 2051, the lasercolor development layer 2052, and a transparent protective layer 2055.These layers are laminated in this order from the lower side Z1 to theupper side Z2.

The base material layer 2051 is a layer corresponding to a base materialof the hinged laminated body 2010. A color of the base material layer2051 preferably has high concealing property not transmitting light (forexample, white, etc.).

The base material layer 2051 includes a print layer 2051 a on the upperside Z2. The print layer 2051 a is printed on the base material layer2051 by offset printing, etc. Print content of the print layer 2051 a isa character, a pattern, a symbol, etc. according to a specification ofthe passport 2001. In the example of FIG. 23A and FIG. 23B, the printcontent of the print layer 2051 a is character information 2051 b of“PASSPORT”, “country: AAAA”, and “NAME:”. The print content is common toall users. That is, this print content does not include individualinformation of the user (for example, a photograph, a name, etc. of theuser).

The laser color development layer 2052 has translucency and is colorlessand transparent. The laser color development layer 2052 contains a colordeveloper. For this reason, a range of the laser color development layer2052 irradiated with laser light generates heat and develops a blackcolor. In the embodiment, such color development is also referred to astyping or printing.

Print content of the laser color development layer 2052 is individualinformation of the user. In the example of FIG. 23A and FIG. 23B, only aphotograph image 2052 b and information “BBB CCC” of a name 2052 c ofthe user are illustrated. However, in practice, information such as adate of birth, a passport number, etc. is printed.

Alternatively, the material of the laser color development layer 2052may not contain the color developer as long as color is developed byirradiation with laser light. In addition, color development mayalternatively correspond to a color other than black.

The transparent protective layer 2055 is a layer having translucency.The transparent protective layer 2055 is a protective layer forprotecting the laser color development layer 2052.

The lower layer 2060 includes a base material layer 2061 and atransparent protective layer 2065. These layers are laminated in thisorder from the upper side Z2 to the lower side Z1. The base materiallayer 2061 and the transparent protective layer 2065 are layers similarto the base material layer 2051 and the transparent protective layer2055 of the upper layer 2050.

That is, the base material layer 2061 is a layer corresponding to a basematerial of the hinged laminated body 2010 and has a color of a highconcealing property. In addition, the base material layer 2061 includesa print layer 2061 a on the lower side Z1. This print content (notillustrated) is common to all users.

In addition, the transparent protective layer 2065, which hastranslucency, is a protective layer for protecting the base materiallayer 2061 and the print layer 2061 a thereof.

According to the above configuration, the print content of the lasercolor development layer 2052 of the upper layer 2050 are observablethrough the transparent protective layer 2055. The print content of theprint layer 2051 a of the base material layer 2051 is observable throughthe laser color development layer 2052 and the transparent protectivelayer 2055. In addition, print content of the print layer 2061 a of thebase material layer 2061 of the lower layer 2060 is observable throughthe transparent protective layer 2065.

In addition, since the base material layers 2051 and 2061 have a highlight concealing property, the hinged laminated body 2020 may not bevisually recognized. For this reason, the hinged laminated body 2010 mayblind a part such as the antenna 2035, and thus an appearance isexcellent.

[Manufacturing Method]

FIG. 25A to FIG. 25E are cross-sectional views for description of amethod of manufacturing the layout sheet for the hinged laminated body2020A and the layout sheet for the hinged laminated body 2010A of the3-1st embodiment.

(Method of Manufacturing Layout Sheet for Hinged Laminated Body 2020A)

When the layout sheet for the hinged laminated body 2020A ismanufactured, the hinge layer sheet material 2041A, the intermediatelayer sheet material 2042A, the upper protective layer sheet material2045A, and the lower protective layer sheet material 2046A aremanufactured in advance in a previous process thereof. A hole 2033 isprovided by punching in each of the hinge layer sheet material 2041A andthe intermediate layer sheet material 2042A. The hole 2033 forms a holefor housing the IC module 2030.

The layout sheet for the hinged laminated body 2020A may be manufacturedaccording to the following processes.

(1) Formation Process of Antenna 2035

As illustrated in FIG. 25A, in a state in which the antenna 2035 isdisposed in a coil shape on an upper surface of the intermediate layersheet material 2042A, the antenna 2035 is buried in the intermediatelayer sheet material 2042A by hot pressing. Four antennas 2035 may besimultaneously buried. Alternatively, the antenna 2035 may be buried inthe hinge layer sheet material 2041A. In this case, hot pressing may beperformed in a state in which the four antennas 2035 are disposed in thehinge layer sheet material 2041A.

(2) Connection Process of IC Module 2030 and Antenna 2035

As illustrated in FIG. 25B, the IC module 2030 is housed in the hole2033 of the intermediate layer sheet material 2042A. In addition, themounted substrate 2031 and the both ends of the antenna 2035 areelectrically and mechanically connected by an electrically conductivepaste, etc.

(3) Lamination Process

As illustrated in FIG. 25C, the hinge layer sheet material 2041A, theintermediate layer sheet material 2042A, the upper protective layersheet material 2045A, and the lower protective layer sheet material2046A are laminated. Here, when the hinge layer sheet material 2041A andthe intermediate layer sheet material 2042A are laminated, positioningis performed such that centers of holes 2033 of the two sheet materialsalign with each other. In this way, four hinge sections 2041 a of thehinge layer sheet material 2041A protrude the same length from both endsof the intermediate layer sheet material 2042A.

In this way, the lamination process of the hinge layer sheet material2041A has excellent workability.

(4) Hot Pressing Process

As illustrated in FIG. 25C and FIG. 25D, hot pressing is performed in astate in which the respective sheet materials are laminated. In thisway, the respective layers are thermally welded at interfaces thereof.

As described above, it is possible to manufacture the layout sheet forthe hinged laminated body 2020A.

(Method of Manufacturing Layout Sheet for Hinged Laminated Body 2010Aand Hinged Laminated Body 2010)

When the (upper layer/lower layer-equipped) layout sheet for the hingedlaminated body 2010A is manufactured, the (non-upper layer/lowerlayer-equipped) layout sheet for the hinged laminated body 2020A, basematerial layer sheet materials 2051A and 2061A, a laser colordevelopment layer sheet material 2052A, and transparent protective layersheet materials 2055A and 2065A are manufactured in advance in aprevious process thereof.

The base material layer sheet material 2051A, the laser colordevelopment layer sheet material 2052A, and the transparent protectivelayer sheet material 2055A correspond to a sheet material (upper layerlayout sheet) in which four members forming the upper layer 2050 arearranged in the XY plane direction at positions corresponding to thehinged laminated bodies 2020 of the layout sheet for the hingedlaminated body 2020A. Similarly, the base material layer sheet material2061A and the transparent protective layer sheet material 2065Acorrespond to a sheet material (lower layer layout sheet) in which fourmembers forming the lower layer 2060 are arranged in the XY planedirection at positions corresponding to the hinged laminated bodies 2020of the layout sheet for the hinged laminated body 2020A.

External shapes of the base material layer sheet materials 2051A and2061A, the laser color development layer sheet material 2052A, and thetransparent protective layer sheet materials 2055A and 2065A are equalto external shapes of other sheet materials 2042A, 2045A and 2046A ofthe layout sheet for the hinged laminated body 2020A.

The layout sheet for the hinged laminated body 2010A may be manufacturedaccording to the following processes.

(1) Lamination Process of Upper Layer 2050 (Upper Layer LaminationProcess)

The base material layer sheet material 2051A, the laser colordevelopment layer sheet material 2052A, and the transparent protectivelayer sheet material 2055A are laminated on the upper side Z2 of thelayout sheet for the hinged laminated body 2020A (see FIG. 20B).

(2) Lamination Process of Lower Layer 2060 (Lower Layer LaminationProcess)

The base material layer sheet material 2061A and the transparentprotective layer sheet material 2065A are laminated on the lower side Z1of the layout sheet for the hinged laminated body 2020A (see FIG. 20B).

(3) Hot Pressing Process

As illustrated in FIG. 25E, hot pressing is performed in a state inwhich the respective members are laminated in the above processes (1)and (2). In this way, the respective layers are thermally welded atinterfaces thereof.

Through the processes so far, it is possible to manufacture the layoutsheet for the hinged laminated body 2010A in which the hinged laminatedbodies 2010 are arranged.

(4) Individual Piece Separation Process

Separation into individual pieces is performed by cutting throughpunching the layout sheet for the hinged laminated body 2010A thermallywelded in the above process (3) into external shapes of the respectivehinged laminated bodies 2010. In this way, the four hinged laminatedbodies 2010 may be manufactured.

In this case, a shape of the cut portion 2002 of each hinged laminatedbody 2010 is a U-shape in which the hinge section 2041 a side is open(see FIG. 20A). In this way, the hinge section 2041 a remains in eachhinged laminated body 2010.

In this way, it is possible to manufacture the hinged laminated body2010 in which the hinge section 2041 a protrudes from a part of a sidesurface by cutting the layout sheet for the hinged laminated body 2010A(that is, the layout sheet for the hinged laminated body 2020A) suchthat four hinge sections 2041 a remain. For this reason, it is possibleto simultaneously manufacture a plurality of hinged laminated bodies2010 similarly with conventional card manufacturing. In this way, thehinged laminated body 2010 may be manufactured easily and at low cost.

The hinged laminated body 2010 after individual piece separation isprocessed into the passport 2001 by binding the hinge section 2041 a(see FIG. 24B). In addition, after (or before) being processed into thepassport 2001, the hinged laminated body 2010 after individual pieceseparation is irradiated with laser light, thereby being printed withindividual information of the user (the photograph image 2052 b, thename 2052 c, etc.) (see FIG. 23A).

In a state in which the layout sheet for the hinged laminated body 2010Ais not cut or in a state in which the layout sheet for the hingedlaminated body 2010A is cut in a form of a layout sheet for a hingedlaminated body in which a plurality of (for example, two) hingedlaminated bodies 2010 is connected to each other, binding may beperformed in a mode in which a plurality of passports is arranged(so-called multiple layout).

In this case, after binding, the layout sheet for the hinged laminatedbody 2010A is separated into individual pieces corresponding to thehinged laminated bodies 2010 by separating the passport into individualpieces. In this case, separation into individual pieces corresponding tothe hinged laminated bodies 2010 may be performed after binding, andthus a binding process may be performed according to a specification ofa binding machine, convenience in manufacturing, etc.

As described above, when the hinged laminated body 2010 of the presentembodiment is manufactured using the layout sheet for the hingedlaminated body 2020A, the hinged laminated body 2010 in which the hingesection 2041 a protrudes may be manufactured easily and at low cost.

3-2nd Embodiment

Next, a description will be given of a 3-2nd embodiment of theinvention.

In the following description and drawings, a portion having the samefunction as that of the above-described 3-1st embodiment will beappropriately denoted by the same reference numeral or the same suffix(last two digits), and a repeated description will be appropriatelyomitted.

FIG. 26A to FIG. 26C are diagrams for description of a layout sheet fora hinged laminated body 2220A of the 3-2nd embodiment.

FIG. 26A is a diagram of the layout sheet for the hinged laminated body2220A viewed from an upper side Z2 in a thickness direction Z (normaldirection of an upper surface).

FIG. 26B is a cross-sectional view of the layout sheet for the hingedlaminated body 2220A (B-B sectional view of FIG. 26A).

FIG. 26C is a cross-sectional view for description of a method ofmanufacturing the layout sheet for the hinged laminated body 2220A.

As illustrated in FIG. 26A and FIG. 26B, in the layout sheet for thehinged laminated body 2220A, two hinge layer sheet materials 2241A aredisposed only at an edge of a side (at least one side) on a left side X1and an edge of a side (at least one side) on a right side X2,respectively. That is, the respective hinge layer sheet materials 2241Aare disposed only at edges along a left side surface and a right sidesurface corresponding to side surfaces from which hinge sections 2241 aprotrude.

In a left-right direction X, a thickness adjustment layer sheet material2243A is laminated inside the two hinge layer sheet materials 2241A. Athickness of the thickness adjustment layer sheet material 2243A is thesame as a thickness of the hinge layer sheet materials 2241A. That is,the thickness adjustment layer sheet material 2243A provides anadjustment related to the thickness of the hinge layer sheet materials2241A. The thickness adjustment layer sheet material 2243A is formed ofthe similar material as that of the intermediate layer sheet material2042A.

The layout sheet for the hinged laminated body 2220A may form the uppersurface and the lower surface flat by including the thickness adjustmentlayer sheet material 2243A.

As illustrated in FIG. 26C, when the layout sheet for the hingedlaminated body 2220A is manufactured, first, the thickness adjustmentlayer sheet material 2243A is laminated on the intermediate layer sheetmaterial 2042A.

Thereafter, the hinge layer sheet materials 2241A and the intermediatelayer sheet material 2042A are positioned such that a part forming thehinge section 2241 a of the hinge layer sheet material 2241A on theright side X2 protrudes from the intermediate layer sheet material2042A. Similarly, the hinge layer sheet material 2241A on the left sideX1 and the intermediate layer sheet material 2042A are positioned.

In this way, in a state in which the hinge layer sheet materials 2241Aare positioned and laminated, the respective layers are thermally weldedat interfaces thereof by a hot pressing process similarly to the 3-1stembodiment (see FIG. 25C and FIG. 25D).

As described above, it is possible to manufacture the layout sheet forthe hinged laminated body 2220A.

As described above, since the hinge layer sheet materials 2241A aredisposed only along the edges at which the hinge sections 2241 a areprovided in the layout sheet for the hinged laminated body 2220A of thepresent embodiment, it is possible to reduce external shapes of thehinge layer sheet materials 2241A. In this way, the layout sheet for thehinged laminated body 2220A may suppress material cost, and thus ismanufactured at low cost.

3-3rd Embodiment

Next, a description will be given of a 3-3rd embodiment of theinvention.

FIG. 27A and FIG. 27B are diagrams for description of a layout sheet fora hinged laminated body 2310A of a 3-3rd embodiment (diagramscorresponding to FIG. 20A and FIG. 20B).

FIG. 27A is a diagram of the layout sheet for the hinged laminated body2310A viewed from an upper side Z2 in a thickness direction Z (a normaldirection of an upper surface).

FIG. 27B is a cross-sectional view (B-B sectional view of FIG. 27A) ofthe layout sheet for the hinged laminated body 2310A.

(Configuration of Layout Sheet for Hinged Laminated Body 2310A)

A configuration of a single part of a hinged laminated body 2310 of thepresent embodiment is similar to that in the 3-1st embodiment.

However, hinged laminated bodies 2310 adjacent to each other in aleft-right direction X are disposed such that side surfaces from whichhinge sections 2341 a protrude are inside the layout sheet for thehinged laminated body 2310A. The hinged laminated bodies 2310 adjacentto each other in the left-right direction X are continuous as a resultof the hinge sections 2341 a being connected to each other.

(Configuration of Layout Sheet for Hinged Laminated Body 2320A)

FIG. 28A to FIG. 28C are diagrams for description of a layout sheet fora hinged laminated body 2320A of the 3-3rd embodiment.

FIG. 28A is a diagram of the layout sheet for the hinged laminated body2320A viewed from the upper side Z2 in the thickness direction Z (anormal direction of an upper surface).

FIG. 28B is a cross-sectional view (B-B sectional view of FIG. 28A) ofthe layout sheet for the hinged laminated body 2320A.

FIG. 28C is a cross-sectional view for description of a method ofmanufacturing the layout sheet for the hinged laminated body 2320A.

As illustrated in FIG. 28A and FIG. 28B, in the layout sheet for thehinged laminated body 2320A, similarly to the hinged laminated bodies2310 of the layout sheet for the hinged laminated body 2310A, fourhinged laminated bodies 2320 are disposed. That is, hinged laminatedbodies 2320 adjacent to each other in the left-right direction X havehinge sections 2341 a disposed toward the inside of the layout sheet forthe hinged laminated body 2320A and are continuous through the hingesections 2341 a thereof.

In addition, a hinge layer sheet material 2341A is larger than anexternal shape of other sheet materials and is laminated on the entiresurface of the layout sheet for the hinged laminated body 2320A.

(Method of Manufacturing Layout Sheet for Hinged Laminated Body 2320A)

As illustrated in FIG. 28A and FIG. 28C, manufacturing of the layoutsheet for the hinged laminated body 2310A is performed such that thehinged laminated bodies 2320 are formed on respective left and rightsides as below. Hereinafter, a different part from that of the 3-1stembodiment will be mainly described.

(1) As a configuration of two hinged laminated bodies 2320 on a leftside X1, two antennas are formed in an intermediate layer sheet material2342A having two intermediate layers. Similarly, two antennas are formedin an intermediate layer sheet material 2342A on a right side X2.

(2) As a configuration of the two hinged laminated bodies 2320 on theleft side X1, an intermediate layer sheet material 2342A having twointermediate layers, an upper protective layer sheet material 2345Ahaving two upper protective layers, and a lower protective layer sheetmaterial 2346A having two lower protective layers are laminated withrespect to one hinge layer sheet material 2341A (laminate manufacturedin the above process (1)). Similarly, an intermediate layer sheetmaterial 2342A on the right side X2, an upper protective layer sheetmaterial 2345A on the right side X2, and a lower protective layer sheetmaterial 2346A on the right side X2 are laminated with respect to onehinge layer sheet material 2341A (laminate manufactured in the aboveprocess (1)). Then, the layers are welded by hot pressing at interfacesthereof.

As described above, it is possible to manufacture the layout sheet forthe hinged laminated body 2320A.

In the above process, the hinge layer sheet material 2341A and the othersheet materials may be positioned by aligning a left end or a right end,and thus workability is excellent. In a case in which this positioningis performed at an end on the hinge section 2341 a side, an operationmay be easily performed if a jig, etc. for brining ends of the othersheet materials 2341A, 2342A, 2345A, and 2346A into contact with eachother is used.

(Method of Manufacturing Layout Sheet for Hinged Laminated Body 2310Aand Hinged Laminated Body 2310)

As illustrated in FIG. 27B, similarly to the layout sheet for the hingedlaminated body 2320A, manufacture of the layout sheet for the hingedlaminated body 2310A is performed such that the hinged laminated bodies2310 are formed on respective left and right sides. Hereinafter, adifferent part from that of the 3-1st embodiment will be mainlydescribed.

(1) A base material layer sheet material 2351A, a laser colordevelopment layer sheet material 2352A, a transparent protective layersheet material 2355A, a base material layer sheet material 2361A, and atransparent protective layer sheet material 2365A, each of which has twomembers, are laminated respectively on the left side X1 and the rightside X2 of the layout sheet for the hinged laminated body 2320Amanufactured in the above-described process. Then, the respective layersare welded at interfaces thereof by hot pressing.

Similarly to the method of manufacturing the layout sheet for the hingedlaminated body 2320A, positioning of the respective members is excellentin workability.

(2) Separation into individual pieces is performed by cutting throughpressing the layout sheet for the hinged laminated body 2310A thermallywelded in the above process (1) into external shapes of the respectivehinged laminated bodies 2310 (individual piece separation process).

In this case, shapes of cut portions 2302 of the respective hingedlaminated bodies 2310 are rectangles corresponding to the respectivehinged laminated bodies 2310. In the layout sheet for hinged laminatedbodies 2310A adjacent to each other in the left-right direction X,inside cut portions 2302 coincide with each other. For this reason, thecontinuous hinge section 2341 a is cut. In this way, the layout sheetfor the hinged laminated bodies 2310A adjacent to each other in theleft-right direction X is separated into left and right parts.

As described above, in the layout sheet for the hinged laminated body2320A of the present embodiment, the hinged laminated bodies 2310 may bemanufactured by making the hinge sections 2341 a of the hinged laminatedbodies 2320 adjacent to each other in the left-right direction Xcontinuous and cutting the hinge sections. For this reason, similarly tothe 3-1st embodiment, the hinged laminated body 2310 in which the hingesection 2341 a protrudes may be manufactured easily and at low cost.

3-4th Embodiment

Next, a description will be given of a 3-4th embodiment of theinvention. In the following description and drawings, a portion havingthe same function as that of the above-described 3-2nd and 3-3rdembodiments will be appropriately denoted by the same reference numeralor the same suffix (last two digits), and a repeated description will beappropriately omitted.

FIG. 29A to FIG. 29C are diagrams for description of a layout sheet fora hinged laminated body 2420A of a 3-4th embodiment.

FIG. 29A is a diagram of the layout sheet for the hinged laminated body2420A viewed from an upper side Z2 in a thickness direction Z (a normaldirection of an upper surface).

FIG. 29B is a cross-sectional view (B-B sectional view of FIG. 29A) ofthe layout sheet for the hinged laminated body 2420A.

FIG. 29C is a cross-sectional view for description of a method ofmanufacturing the layout sheet for the hinged laminated body 2420A.

As illustrated in FIG. 29A and FIG. 29B, the layout sheet for the hingedlaminated body 2420A is obtained by changing the hinge layer sheetmaterial (see FIG. 28B) of the layout sheet for the hinged laminatedbody of the 3-3rd embodiment to the hinge layer sheet material and thethickness adjustment layer sheet material (see FIG. 26B) as in thesecond embodiment.

A hinge layer sheet material 2441A is disposed to extend in alongitudinal direction Y in a center range relative to left and rightdirections of the layout sheet for the hinged laminated body 2420A. Inthis way, in a hinged laminated body 2420 on a left side X1, a hingelayer sheet material 2441A is disposed only at an edge of a side (atleast one side) on a right side X2. In addition, in a hinged laminatedbody 2420 on the right side X2, a hinge layer sheet material 2441A isdisposed only at an edge of a side (at least one side) on the left sideX1.

Further, similarly to the 3-3rd embodiment, hinged laminated bodies 2420adjacent to each other in a left-right direction X are continuousthrough hinge sections 2441 a thereof.

As illustrated in FIG. 29C, when the layout sheet for the hingedlaminated body 2420A is manufactured, first, a thickness adjustmentlayer sheet material 2443A and an intermediate layer sheet material2342A may be laminated, and a laminate in which an antenna and an ICmodule are formed may be manufactured, on each of the left side X1 andthe right side X2. Then, laminates on the left side X1 and the rightside X2 may be connected to each other by laminating the hinge layersheet material 2441A on the laminates on the left side X1 and the rightside X2.

Thereafter, according to the same processes as those of the 3-3rdembodiment, it is possible to manufacture the layout sheet for thehinged laminated body 2420A, the layout sheet for the hinged laminatedbody, and the hinged laminated body.

As described above, similarly to the 3-2nd embodiment, the layout sheetfor the hinged laminated body 2420A of the present embodiment may reducean external shape of the hinge layer sheet material 2441A, and thus ismanufactured at low cost.

(Modifications)

(1) In the 3-1st to 3-4th embodiments, an example in which the (upperlayer/lower layer-equipped) layout sheet for the hinged laminated bodyis cut to separate the (upper layer/lower layer-equipped) hingedlaminated bodies into individual pieces has been shown. However, theinvention is not limited thereto. The (non-upper layer/lowerlayer-equipped) hinged laminated bodies may be separated into individualpieces by cutting a single part of the (non-upper layer/lowerlayer-equipped) layout sheet for the hinged laminated body into externalshapes of the (non-upper layer/lower layer-equipped) hinged laminatedbodies (individual piece separation process).

In this mode, for example, it is possible to manufacture the (upperlayer/lower layer-equipped) hinged laminated body by laminating anotherlayer on the individual (non-upper layer/lower layer-equipped) hingedlaminated body. In addition, the (non-upper layer/lower layer-equipped)hinged laminated body may be used as is for management of a booklet,etc. by binding the individual (non-upper layer/lower layer-equipped)hinged laminated body into the booklet without change.

In addition, when the (non-upper layer/lower layer-equipped) hingedlaminated body is bound into the booklet without being changed to the(upper layer/lower layer-equipped) hinged laminated body as describedabove, similarly to the description of the individual piece separationprocess of the 3-1st embodiment, binding may be performed in a state inwhich the (non-upper layer/lower layer-equipped) layout sheet for thehinged laminated body is not cut or in a state in which the (non-upperlayer/lower layer-equipped) layout sheet for the hinged laminated bodyis punched to form a (non-upper layer/lower layer-equipped) layout sheetfor a hinged laminated body in which a plurality of (for example, two)(non-upper layer/lower layer-equipped) hinged laminated bodies isconnected to each other, thereby performing binding and individual pieceseparation.

(2) In the embodiments, an example in which the hinged laminated bodiesare arranged in both the left-right direction and the longitudinaldirection in the layout sheet for the hinged laminated body has beenshown. However, the invention is not limited thereto. It is possible toadopt a mode in which the hinged laminated bodies are arranged in one ofthe left-right direction and the longitudinal direction in the layoutsheet for the hinged laminated body.

(3) A security film such as a hologram layer, etc. may be provided inthe hinged laminated body of the embodiments.

In this case, for example, in FIG. 23A and FIG. 23B, the security filmmay be laminated between the laser color development layer 2052 and thebase material layer 2051 (print layer 2051 a).

(4) The laminated configuration of the hinged laminated body of theembodiments may be appropriately modified. For example, theconfiguration of FIG. 23A and FIG. 23B may be modified as below.

The print layer 2051 a may not be provided on the base material layer2051, and a transparent layer printed with the same content as that ofthe print layer 2051 a may be laminated on the lower side of thetransparent protective layer 2055 (that is, between the laser colordevelopment layer 2052 and the transparent protective layer 2055). Inthis case, a security film such as a hologram layer may be laminatedbetween the laser color development layer 2052 and the printedtransparent layer.

EXPLANATION OF REFERENCE NUMERALS

1 . . . passport, 10, 210, 310, 410, 510, 610 . . . hinged laminatedbody, 10A . . . layout sheet for hinged laminated body, 20, 220, 320,420, 520, 620 . . . hinged laminated body, 20A . . . layout sheet forhinged laminated body, 30 . . . IC module, 31 . . . mounted substrate,32 . . . IC chip, 35 . . . antenna, 41, 241, 341, 441, 541, 641 . . .hinge layer, 41 a . . . hinge section, 42, 349, 449, 542, 642 . . .intermediate layer (non-hinge layer), 45 . . . upper protective layer,46 . . . lower protective layer, 47, 347, 447, 547, 647 . . . IC modulehousing hole, 47 a . . . first housing hole, 47 b . . . second housinghole, 48, 248, 548, 648 . . . antenna buried groove, 50 . . . upperlayer, 51, 61 . . . base material layer, 51 a, 51 c, 61 a, 61 c . . .print layer, 52 . . . laser color development layer, 55, 65 . . .transparent protective layer, 56 . . . upper layer window portion, 60 .. . lower layer, 66 . . . lower layer window portion, 70 . . . hologramlayer 1001 . . . passport, 1010, 1210, 1310, 1410, 1510 . . . hingedlaminated body, 1010A . . . layout sheet for hinged laminated body,1020, 1220, 1320, 1420, 1520 . . . hinged laminated body, 1020A . . .layout sheet for hinged laminated body, 1030 . . . IC module, 1031 . . .mounted substrate, 1032 . . . IC chip, 1035 . . . antenna, 1041, 1241,1341, 1441 . . . hinge layer, 1041 a . . . hinge section, 1042, 1242,1342, 1442, 1542 . . . thickness adjustment layer, 1043, 1349, 1449,1543 . . . intermediate layer, 1045 . . . upper protective layer, 1046 .. . lower protective layer, 1047, 1347, 1447 . . . IC module housinghole, 1048, 1248 . . . antenna buried groove, 1050 . . . upper layer,1051, 1061 . . . base material layer, 1051 a, 1051 c, 1061 a, 1061 c . .. print layer, 1052 . . . laser color development layer, 1055, 1065 . .. transparent protective layer, 1056 . . . upper layer window portion,1060 . . . lower layer, 1066 . . . lower layer window portion, 1070 . .. hologram layer 2001 . . . passport, 2002, 2302 . . . cut portion,2003, 2303 . . . space, 2010, 2310, hinged laminated body, 2010A, 2310A. . . layout sheet for hinged laminated body, 2020, 2220, 2320, 2420 . .. hinged laminated body, 2020A, 2220A, 2320A, 2420A . . . layout sheetfor hinged laminated body, 2041 . . . hinge layer, 2041A, 2241A, 2441A .. . hinge layer sheet material, 2041 a, 2241 a, 2341 a, 2441 a . . .hinge section, 2042 . . . intermediate layer, 2042A, 2342A . . .intermediate layer sheet material, 2045 . . . upper protective layer,2045A, 2345A . . . upper protective layer sheet material, 2046 . . .lower protective layer, 2046A, 2346A . . . lower protective layer sheetmaterial, 2051 . . . base material layer, 2051A, 2351A . . . basematerial layer sheet material, 2052 . . . laser color development layer,2052A, 2352A . . . laser color development layer sheet material, 2055 .. . transparent protective layer, 2055A, 2355A . . . transparentprotective layer sheet material, 2061 . . . base material layer, 2061A,2361A . . . base material layer sheet material, 2065 . . . transparentprotective layer, 2065A, 2365A . . . transparent protective layer sheetmaterial, 2243A, 2443A . . . thickness adjustment layer sheet material

1. A hinged laminated body comprising: an IC module having an IC chipcapable of performing contactless communication; a hinge layer having ahinge section bindable into a booklet; and a non-hinge layer which islaminated on the hinge layer and does not have a hinge section, whereinthe hinge layer is provided on an entire surface of the hinged laminatedbody, the hinge layer and the non-hinge layer have a housing holepenetrating across the two layers, and the IC module is housed and heldin the housing hole.
 2. The hinged laminated body according to claim 1,wherein the IC module further has a mounted substrate on one surface ofwhich the IC chip is mounted, a width of the mounted substrate is largerthan a width of the IC chip in a cross-sectional view, and the housinghole is divided into a first housing hole on a side of the hinge layerand a second housing hole on a side of the non-hinge layer in thecross-sectional view, the first housing hole houses one of the mountedsubstrate and the IC chip, and the second housing hole houses the otherone of the mounted substrate and the IC chip.
 3. The hinged laminatedbody according to claim 2, wherein the first housing hole or the secondhousing hole housing the IC chip has an amount of a width not allowingthe mounted substrate to be housed.
 4. The hinged laminated bodyaccording to claim 1, wherein a melting temperature of the hinge layeris different from a melting temperature of the non-hinge layer.
 5. Thehinged laminated body according to claim 1, further comprising anantenna connected to the IC chip, wherein one of or both the hinge layerand the non-hinge layer have an antenna buried groove in which theantenna is buried.
 6. The hinged laminated body according to claim 1,further comprising: an upper layer laminated on an upper side of thehinge layer and the non-hinge layer; and a lower layer laminated on alower side of the hinge layer and the non-hinge layer.
 7. The hingedlaminated body according to claim 6, wherein the hinge layer and thenon-hinge layer have translucency, the upper layer includes an upperlayer window portion through which a part of one of the hinge layer andthe non-hinge layer close to the upper layer is visually recognizable,and the lower layer includes a lower layer window portion through whicha part of one of the hinge layer and the non-hinge layer close to thelower layer is visually recognizable and which is provided in a regionoverlapping the upper layer window portion.
 8. A layout sheet for ahinged laminated body in which a plurality of hinged laminated bodiesaccording to claim 1 is arranged.
 9. A booklet in which the hingedlaminated body according to claim 1 is bound at the hinge sectionincluded in the hinged laminated body.
 10. A hinged laminated bodycomprising: an IC module having an IC chip capable of performingcontactless communication; an antenna connected to the IC chip; and ahinge layer having a hinge section bindable into a booklet, wherein thehinge layer is laminated on a part of the hinged laminated body when anupper surface of the hinged laminated body is viewed in a normaldirection, and the hinged laminated body further comprises a thicknessadjustment layer which is laminated at a same position as a position ofthe hinge layer in a thickness direction, has a thickness correspondingto the hinge layer, and holds at least one of the IC module and theantenna.
 11. The hinged laminated body according to claim 10, whereinthe thickness adjustment layer forms at least a part of a housing holethat holds the IC module by housing the IC module therein.
 12. Thehinged laminated body according to claim 10, further comprising ahousing hole that houses the IC module, wherein the thickness adjustmentlayer covers an opening of the housing hole.
 13. The hinged laminatedbody according to claim 10, further comprising an antenna buried layerhaving an antenna buried groove in which the antenna is buried, whereinthe thickness adjustment layer holds the antenna by covering an openingof the antenna buried groove of the antenna buried layer.
 14. The hingedlaminated body according to claim 10, wherein the thickness adjustmentlayer includes an antenna buried groove in which the antenna is buried.15. The hinged laminated body according to claim 10, further comprising:an upper layer laminated on an upper side of the hinge layer and thethickness adjustment layer; and a lower layer laminated on a lower sideof the hinge layer and the thickness adjustment layer.
 16. The hingedlaminated body according to claim 15, wherein the hinge layer and/or thethickness adjustment layer has translucency, the upper layer includes anupper layer window portion through which a part of the hinge layer andthe thickness adjustment layer is visually recognizable, and the lowerlayer includes a lower layer window portion through which a part of thehinge layer and the thickness adjustment layer is visually recognizableand which is provided in a region overlapping the upper layer windowportion.
 17. A layout sheet for a hinged laminated body in which aplurality of hinged laminated bodies according to claim 10 is arranged.18. A booklet in which the hinged laminated body according to claim 10is bound at the hinge section included in the hinged laminated body. 19.A layout sheet for a hinged laminated body in which a plurality ofhinged laminated bodies is arranged, wherein the hinged laminated bodyincludes: an IC chip capable of performing contactless communication; anantenna connected to the IC chip; and a hinge layer having a hingesection bindable into a booklet.
 20. The layout sheet for a hingedlaminated body according to claim 19, wherein the hinge sectionprotrudes at a side surface on a bound side.
 21. The layout sheet for ahinged laminated body according to claim 19, wherein hinge sections ofadjacent hinged laminated bodies are disposed along at least one side ofthe layout sheet for a hinged laminated body.
 22. The layout sheet for ahinged laminated body according to claim 19, wherein hinge sections ofadjacent hinged laminated bodies are disposed on opposite sides of thelayout sheet for a hinged laminated body.
 23. The layout sheet for ahinged laminated body according to claim 19, wherein a hinge layer sheetmaterial in which hinge layers of the plurality of hinged laminatedbodies are arranged is laminated exclusively at an edge of a side alonga side surface from which the hinge section protrudes.
 24. The layoutsheet for a hinged laminated body according to claim 19, wherein a hingelayer sheet material in which hinge layers of the plurality of hingedlaminated bodies are arranged is larger than an external shape ofanother sheet material of the layout sheet for a hinged laminated bodyand is laminated on an entire surface of the layout sheet for a hingedlaminated body.
 25. The layout sheet for a hinged laminated bodyaccording to claim 19, wherein hinge sections of adjacent hingedlaminated bodies are disposed along at least one side of the layoutsheet for a hinged laminated body, and a hinge layer sheet material inwhich hinge layers of the adjacent hinged laminated bodies are arrangedis laminated exclusively at an edge along at least the one side.
 26. Alayout sheet for a hinged laminated body in which a plurality of hingedlaminated bodies is arranged, wherein the hinged laminated bodyincludes: an IC chip capable of performing contactless communication; anantenna connected to the IC chip; a hinge layer having a hinge sectionbindable into a booklet; and hinge sections of adjacent hinged laminatedbodies are disposed on an inside of the layout sheet for a hingedlaminated body, and the adjacent hinged laminated bodies are connectedthrough the hinge sections thereof.
 27. The layout sheet for a hingedlaminated body according to claim 26, wherein the hinge sectionprotrudes at a side surface on a bound side.
 28. The layout sheet for ahinged laminated body according to claim 26, wherein the hinge layer ofthe hinged laminated body is laminated exclusively at an edge of a sidealong a side surface from which the hinge section protrudes.
 29. Thelayout sheet for a hinged laminated body according to claim 26, whereina hinge layer sheet material in which hinge layers of the plurality ofhinged laminated bodies are arranged is larger than an external shape ofanother sheet material of the layout sheet for a hinged laminated bodyand is laminated on an entire surface of the layout sheet for a hingedlaminated body.
 30. A method of manufacturing a hinged laminated bodyusing the layout sheet for the hinged laminated body according to claim19, the method comprising: an individual piece separation process ofseparating the hinged laminated bodies into individual pieces such thatthe hinge sections remain by cutting the layout sheet for the hingedlaminated body.
 31. A method of manufacturing a hinged laminated bodyusing the layout sheet for the hinged laminated body according to claim19, the method comprising: an upper layer lamination process oflaminating an upper layer layout sheet in which a plurality of upperlayers is arranged on the layout sheet for the hinged laminated body; alower layer lamination process of laminating a lower layer layout sheetin which a plurality of lower layers is arranged on the layout sheet forthe hinged laminated body; a hot pressing process of thermally weldinglayers of the layout sheet for the hinged laminated body at interfacesthereof, and the upper layer layout sheet and the lower layer layoutsheet; and an individual piece separation process of separating thehinged laminated bodies into individual pieces such that the hingesections remain by cutting the thermally welded layers.